The Simulation Study on Heat Dissipation of High Power LED Based on the Natural Convection

Article Preview

Abstract:

In this paper, we studied on the heat dissipation of high power LED in numerical simulation by the large eddy simulation numerical methods with the simulation software FDS, and studied the temperature distribution and heat pipe cooling respectively, etc.. We did the numerical simulation research on the heat dissipation of high power LED fin by numerical simulation, and obtained the numerical solution of all the LED temperature field and flow field. The air flow rate near the radiating surface was low; the fin surface temperature distribution was basic uniform and closed to the temperature of the constant heat reservoir. The analysis of the results of numerical simulation provided references for the improvement of optimal design of LED radiator.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

1454-1458

Citation:

Online since:

December 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] C.M. Bourget. An Introduetion to Light-emitting Diodes[J]. Hortseience, 2008, 43(7): 1944-(1946).

Google Scholar

[2] Chun-Jen Weng. Advanced thermal enhancement and management of LED packages [J] International Congress Series, 2009, (3).

Google Scholar

[3] Lan Kim; Jong Hwa Choi; Sun Ho Jang, et al. Thermal analysis of LED array system withheatpipe[J]Thermochimica Acta, (2007).

Google Scholar

[4] L. Q. Yin;L. Q. Yang;W. Q. Yang et al. Thermal design and analysis of multi-chip LED module with ceramic substrate[J]Solid State Electronics, 2010, (12).

DOI: 10.1016/j.sse.2010.06.028

Google Scholar

[5] CHEN Huanting; LU Yi Jun; GAO Yu Lin, et al. The performance of compact thermal models for LED package[J]Thermochimica Acta, 2009, (1-2).

Google Scholar

[6] Arik M. Petroski J, Weaver S.Thermal challenges in the future generation solid state lighting applications: light emitting diodes[A]. ASME/IEEE International Packaging Technical Conference [C]. Hawaii, (2001).

DOI: 10.1109/itherm.2002.1012446

Google Scholar

[7] ShengLiu, TimLin, XiaobingLuo, etal. A Microjet Array Colling System for Thermal Management of Active Raders and High-Brightness LEDs. Electronic Components and Technology conference. 2006: 1634-1638.

DOI: 10.1109/ectc.2006.1645876

Google Scholar

[8] Lan Kim, Jong Hwa Choi, Sun Ho Jang, et al. Thermal analysis of LED array system with heat pipe[J] . Thermochimica Acta , 2007, 455 : 21-25.

DOI: 10.1016/j.tca.2006.11.031

Google Scholar

[9] Moo Whan Shin. Thermal design of high-power LED package and system [J] . Proc. SPIE , 2006 , 6355 : 9-21.

Google Scholar

[10] Gwo-Jiun Sheu, Farn-Shiun Hwu, Shen-Hang Tu, et al. The heat dissipation performance of LED applied a MHP [J] . Proc. SPIE, 2005, 5941: 13-20.

Google Scholar