Investigation of Surface Roughness on Platinum Deposited Wafer after Reactive Ion Etching Using SF6+Argon Gaseous

Zaliman Sauli; Vithyacharan Retnasamy; Aaron Koay Terr Yeow; Goh Siew Chui; K. Anwar; Nooraihan Abdullah

doi:10.4028/www.scientific.net/AMM.487.210

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 487Investigation of Surface Roughness on Platinum...

Investigation of Surface Roughness on Platinum Deposited Wafer after Reactive Ion Etching Using SF₆+Argon Gaseous

Abstract:

This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process variables, with 8 sets of experiments were scrutinized using a systematically designed design of experiment (DOE). The three variables in the investigation are ICP power, Bias power, and working pressure. The estimate of the effect calculated for ICP power, Bias power, and working pressure are-4.9288, -6.2383, and-4.7223 respectively. All three factors gave negative effects. This implies that the surface roughness decreases when ICP power, Bias power, and working pressure is high. The Bias Power is the most influential factor followed by ICP Power, and working pressure.

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Periodical:

Applied Mechanics and Materials (Volume 487)

Pages:

210-213

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.487.210

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Online since:

January 2014

Authors:

Zaliman Sauli*, Vithyacharan Retnasamy, Aaron Koay Terr Yeow, Goh Siew Chui, K. Anwar, Nooraihan Abdullah

Keywords:

Design of Experiment (DOE), Platinum, Reactive Ion Etching (RIE), SF₆+Argon, Surface Roughness (SR)

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