Natural Heat Convection Analysis on Cylindrical Al Slug of LED

Abstract:

This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug was carried out under natural convection condition at ambient temperature of 25°C. The junction temperature and the stress of the LED chip was assesed. The LED chip was powered with input power of 0.1 W and 1 W and the heat dissipation was assesed. Results showed that that the junction temperature and the Von Mises Stress of the single chip LED package increases with the increased input power.

• Periodical: Applied Mechanics and Materials (Volume 487)
• Pages: 536-539
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.487.536
• Online since: January 2014
• Authors: Rajendaran Vairavan, Zaliman Sauli*, Vithyacharan Retnasamy, Nazuhusna Khalid, K. Anwar, Nooraihan Abdullah
• Keywords: ANSYS, Cylindrical Al Slug, LED, Natural Convection

References

[1] S. Hyeong Won, et al., Analysis on thermal resistance of LED module with various thermal vias, in Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the, 2011, pp.1-4.

DOI: 10.1109/ipfa.2011.5992760

[2] Z. Sauli, et al., Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power, in Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on, 2013, pp.290-293.

DOI: 10.1109/uksim.2013.127

[3] Y. J. Heo, H. T. Kim, K. J. Kim, S. Nahm, Y. J. Yoon, and J. Kim, Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package, Applied Thermal Engineering, vol. 50, pp.799-804, (2013).

DOI: 10.1016/j.applthermaleng.2012.07.024

[4] M. Ha and S. Graham, Development of a thermal resistance model for chip-on-board packaging of high power LED arrays, Microelectronics Reliability, vol. 52, pp.836-844, (2012).

DOI: 10.1016/j.microrel.2012.02.005

[5] L. Kim, J. H. Choi, S. H. Jang, and M. W. Shin, Thermal analysis of LED array system with heat pipe, Thermochimica Acta, vol. 455, pp.21-25, (2007).

DOI: 10.1016/j.tca.2006.11.031

[6] Sauli, Z., Retnasamy, V., Taniselass, S., Rahman, N. A. Z., & Aziz, M. H. A., Polymer core BGA stress analysis at minimal vertical loading, Advanced Materials Research Vols., 622-623, pp.639-642, (2013).

DOI: 10.4028/www.scientific.net/amr.622-623.639

[7] Retnasamy, V., Sauli, Z., Rahman, N. A., Hatta, R. M., Vairavan, R., &Norhaimi, W. M. W., Gold ball shear stress analysis on different surface morphology, the Proceedings of International Conference on Computational Intelligence, Modelling and Simulation, 168-171, (2012).

DOI: 10.1109/cimsim.2012.88

[8] M. W. Shin and S. H. Jang, Thermal analysis of high power LED packages under the alternating current operation, Solid-State Electronics, vol. 68, pp.48-50, (2012).

DOI: 10.1016/j.sse.2011.10.033