Defects Detection of Printed Circuit Board Based on the Machine Vision Method

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Abstract:

The processing of target image using image processing technology, can realize the non-contact online detecting circuit board, thus greatly improve the detection efficiency, reducing the defective rate. This paper provides the detection system based on the methods of pre-processing the standard circuit board image and the circuit board image to be detected, two value segmentation, morphological image processing, image registration and poor shadow detection processing, among them ,image registration is the key. In order to improve the processing speed to achieve real-time processing, image registration using rapid processing algorithm. Analysis of the experimental results, the method can detect the defects on the circuit board to be detected accurately, and can achieve the automatic real-time detection purposes.

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785-788

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February 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] Roth, V. and B. Ommer (2006), Exploiting low-level image segmentation for object recognition. Pattern Recognition (Symposium of the DAGM), LNCS, Springer, Vol. 4174, No. pp.11-20.

DOI: 10.1007/11861898_2

Google Scholar

[2] Canny, J.F. (1986), A computational approach to edge detection. IEEE Transactions on Pattern Analysis and Machine Intelligence, Vol. 8, No. 6, pp.679-698.

DOI: 10.1109/tpami.1986.4767851

Google Scholar

[3] D Heinke, and G W. Humphreys, Selective Attention for identification model: simulating visual neglect, Compute. Vis. Image Und. 100, pp.172-197, (2005).

DOI: 10.1016/j.cviu.2004.10.010

Google Scholar

[4] S. kurada, C. Bradely, A machine VISIOn system for tool wear assessment, Tribology international, vol 30, pp.295-304, (2007).

DOI: 10.1016/s0301-679x(96)00058-8

Google Scholar

[5] R. Teti, K. Jemielniak, G. O'Donnell, D. Dornfeld, Advanced monitoring of machining operations, CIRP Annals-Manufacturing Technology 59, 2010, pp.717-739.

DOI: 10.1016/j.cirp.2010.05.010

Google Scholar