A MD Study on the Temperature Influence on Ni/Al Interface at Initial Diffusion Time

Yu Mei Dai; Yu Jie Dai

doi:10.4028/www.scientific.net/AMM.496-500.21

Paper Titles

Effect of Tempering Temperature on Mechanical Properties of 40CrMnSiB Steel
p.3

Cooling-Performance Estimation of the Composite-Graphite Heat Sink with Annular Conductive Base for LED Lamp
p.9

Preparation and Characterization of SrAl₂O₄: Eu²⁺, Dy³⁺ Luminescent Nanofibers
p.13

A Competitive Model Reaction for the Ribosomal Peptide Bond Formation Catalyzed by Peptidyl Transferase
p.17

A MD Study on the Temperature Influence on Ni/Al Interface at Initial Diffusion Time
p.21

A One-Port Waveguide Method and its Application in Characterization of Radar Absorbing Materials
p.26

Ag-Loaded Wool Spherical-Like Bi₂WO₆Nanoarchitectures Photocatalyst Degrade Pigments
p.30

All-Solid-States Thin Film Lithium-Ion Micro-Battery with SnO_X Films Doped with Cu as Negative Electrode
p.38

Candida rugosa Lipase Adsorption on Nylon-6: Optimization, Kinetic and Thermodynamic Analysis
p.42

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 496-500A MD Study on the Temperature Influence on Ni/Al...

A MD Study on the Temperature Influence on Ni/Al Interface at Initial Diffusion Time

Abstract:

The molecular dynamic method and interface diffusion theory are used to simulate Ni/Al metal interface diffusion. One of the unit cells containing 576 Ni atoms and 128 Al atoms is chosen and computed under different temperatures (600K, 700K, 800K, 900K, 1000K, 1100K, 1200K, 1300K), respectively. We mainly analyze the position image of the interface diffusion atoms of Ni/Al interface reaction and the radial distribution function curve of the selected region, after the molecular dynamics program running 1200000 steps, under different temperatures, at initial diffusion time.

You might also be interested in these eBooks

Frontiers of Manufacturing and Design Science IV

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 496-500)

Pages:

21-25

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.496-500.21

Citation:

Cite this paper

Online since:

January 2014

Authors:

Yu Mei Dai, Yu Jie Dai

Keywords:

Computer Simulation, Diffusion, Molecular Dynamic (MD), Ni/Al Interface

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Zhilin Liu, Zhilin Li, Weidong Liu: Interface Electronic Structure and Interface Properties. Beijing: Science Press, (2002), in Chinese.

Google Scholar

[2] Zhien Liu: Materials Science Basis. Xian: Northwestern Polytechnical University Press, (2003), in Chinese.

Google Scholar

[3] Jing Yuan: Study on Al-Fe-Ni System Interface Diffusion. China Petroleum University, (2008), in Chinese.

Google Scholar

[4] J.T. Guo, W. l. Ren and J. Zhou: Metal Journal, Vol. 38(6): (2002), P. 667-672.

Google Scholar

[5] Y.M. Dai, S.L. Zhu and F.H. Wang: Advanced Materials Research, Vol. 391-392: (2012), P. 42-45.

Google Scholar

[6] B. J. Alder and T. E. Wainwright: Chem. Phys, Vol. 27(2): (1957), P. 1208-1209.

Google Scholar

[7] M.S. Daw and M.I. Baskes: Phys. Rev. B, Vol. 29(12): (1984), P. 6443–6453.

Google Scholar

[8] R.L. Andrew: Molecular modeling: Principle and Practice. Berlin Heidelberg: Springer-Verlag, (1996).

Google Scholar