Hydroscopicity and Dielectric Properties of Polyimide Containing Biphenyl and Bis-Benzimidazole Rings

Ying Tao Chen; Hong Xu Lu; Qing Hua Zhang

doi:10.4028/www.scientific.net/AMM.496-500.84

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 496-500Hydroscopicity and Dielectric Properties of...

Hydroscopicity and Dielectric Properties of Polyimide Containing Biphenyl and Bis-Benzimidazole Rings

Abstract:

A kind of Polyimide films (PI films) containing biphenyl and bis-benzimidazole rings were prepared from the its precursor Polyamic acid (PAA) solution synthesized by aromatic diamine containing biphenyl and bis-benzimidazole rings with different commercial aromatic dianhydrides. The PI films exhibited excellent hydrophobicity with the contact angle of higher than 90o and the hydroscopicity are lower than 1%. The PI films also have great dielectric properties of the dielectric constant ranges from 2.10 to 2.94 under the voltage frequency within 1 to 10⁶H_Z.

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Applied Mechanics and Materials (Volumes 496-500)

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84-87

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https://doi.org/10.4028/www.scientific.net/AMM.496-500.84

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Online since:

January 2014

Authors:

Ying Tao Chen, Hong Xu Lu, Qing Hua Zhang*

Keywords:

Bis-Benzimidazole Rings, Dielectric Property, High Performance Polymer, Hydroscopicity, Polyimide

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