Research on the Force-Position Switching Control System of Wire Bonding Head on DSP

Yong Gang Chen; Qiu Sheng Yan; Hang Jun Gong

doi:10.4028/www.scientific.net/AMM.511-512.1118

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 511-512Research on the Force-Position Switching Control...

Research on the Force-Position Switching Control System of Wire Bonding Head on DSP

Abstract:

Presented the force-position switching control system of wire bonding head on DSP. Analysis of the bond head mechanism design theory,for wire bonding high precision motion control requires, design of the force-position switching control system hardware and software. .

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Periodical:

Applied Mechanics and Materials (Volumes 511-512)

Pages:

1118-1122

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.511-512.1118

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Online since:

February 2014

Authors:

Yong Gang Chen*, Qiu Sheng Yan, Hang Jun Gong

Keywords:

Bonding Head, DSP, Force-Position Switching Control

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