Thermal Design of a Satellite Borne FPGA
Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature of the FPGA decreased from 132.5°C to 55.4°C and the junction temperature decreased from 136.1°C to59.0 °C after the thermal design, which matches the requirements of thermal design.
B. Chen "Thermal Design of a Satellite Borne FPGA", Applied Mechanics and Materials, Vols. 52-54, pp. 1411-1414, 2011