Study of Copper Electroplating Films Made by Four Power Modes and Magnetic Field on 20# Steel

Jian Jun Xi; Jun Zhao; Zhi Gang Wang; Chun Ping Zhao; Mei Ping Xue

doi:10.4028/www.scientific.net/AMM.528.14

Paper Titles

The Preparation and Performance of LC4 Aluminum Alloys Ceramic Coatings with Trace Loose Layer Treated by Micro-Arc Oxidation
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Effect of Pulse Electrical Parameters on Performance of Deposited Copper Coatings with Citrate System at Room Temperature
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Study of Copper Electroplating Films Made by Four Power Modes and Magnetic Field on 20# Steel
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Effects of Yttrium on Cyclic Oxidation Resistance of Co-10Cr-5Al Alloy at 700 °C
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Preparation and the PL Properties of Er³⁺ - Ce³⁺ Co-Doped TiO₂ Powders
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Influence of High Temperature Processing on the Substructure of Laser Shock Processed Titanium Alloy
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 528Study of Copper Electroplating Films Made by Four...

Study of Copper Electroplating Films Made by Four Power Modes and Magnetic Field on 20# Steel

Abstract:

Copper electroplating films were prepared on 20# steel by four different power modes which are direct current plating, single polar pulse plating, bipolar pulse plating and bipolar pulse plating with magnetic field. The electrochemical performance was investigated in 3.5% NaCl solution by means of potentiodynamic polarization measurement. The morphology and micro structure were characterized by scanning electron microscope and X-ray diffraction. It is proved that the magnetic field is responsible for the improvement of the performance of copper electroplating films.

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Applied Mechanics and Materials (Volume 528)

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14-18

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https://doi.org/10.4028/www.scientific.net/AMM.528.14

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Online since:

February 2014

Authors:

Jian Jun Xi, Jun Zhao*, Zhi Gang Wang, Chun Ping Zhao, Mei Ping Xue

Keywords:

Copper, Electroplating Films, Magnetic Field, Power Modes

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References

[1] S. Miura, H. Honma, Advanced copper electroplating for application of electronics, J. Sci. Surface and Coatings Technology. 169 –170 (2003) 91–95.

DOI: 10.1016/s0257-8972(03)00165-8

Google Scholar

[2] X.Q. Xu, L.Q. Zhu, W.P. Li, H.C. Liu, A variable hydrophobic surface improves corrosion resistance of electroplating copper coating, J. Sci. Applied Surface Science. 257 (2011) 5524–5528.

DOI: 10.1016/j.apsusc.2011.01.015

Google Scholar

[3] C.H. Chen, C.W. Lu, S.M. Huang, W.P. Dow, Effects of supporting electrolytes on copper electroplating for filling through-hole, J. Sci. Electrochimica Acta. 56 (2011) 5954– 5960.

DOI: 10.1016/j.electacta.2011.04.109

Google Scholar

[4] Tso-Fu M. Chang, T. Shimizu, C. Ishiyama, M. Sone, Effects of pressure on electroplating of copper using supercritical carbon dioxide emulsified electrolyte, J. Sci. Thin Solid Films. 529 (2013) 25–28.

DOI: 10.1016/j.tsf.2012.05.058

Google Scholar

[5] Z. Abdel Hamid, A. Abdel Aal, New environmentally friendly noncyanide alkaline electrolyte for copper electroplating, J. Sci. Surface and Coatings Technology. 203 (2009) 1360–1365.

DOI: 10.1016/j.surfcoat.2008.11.001

Google Scholar

[6] S.Y. Chiu, Y.L. Wang, S.C. Chang, Application of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection, J. Sci. Thin Solid Films. 478 (2005) 293– 298.

DOI: 10.1016/j.tsf.2004.11.187

Google Scholar

[7] K. Weiss, S. Riedel, S.E. Schulz, M. Schwerd, H. Helneder, H. Wendt, T. Gessne, Development of different copper seed layers with respect to the copper electroplating process, J. Sci. Microelectronic Engineering. 50 (2000) 433–440.

DOI: 10.1016/s0167-9317(99)00312-3

Google Scholar

[8] S.S. Abd El Rehim, S.M. Sayyah, M.M. El Deeb, Electroplating of copper films on steel substrates from acidic gluconate baths, J. Sci. Applied Surface Science. 165(2000) 249–254.

DOI: 10.1016/s0169-4332(00)00015-5

Google Scholar