Effect of Pulse Electrical Parameters on Performance of Deposited Copper Coatings with Citrate System at Room Temperature

Abstract:

This article presents a detailed research on pulse electrical parameters for non-cyanide electroplating copper plating on stainless still substrate. The study was made about the effect of the current density, duty ratio and frequency on the surface morphology, thickness and uniformity of the deposited layers. The surface morphology was examined by MIT 300 metallurgical microscope and the thickness of copper coatings was examined by TT260 coating thickness gauge. Current density 0.4A/dm2 is the optimum current at which the best uniform coating can be formed.

• Periodical: Applied Mechanics and Materials (Volume 528)
• Pages: 8-13
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.528.8
• Online since: February 2014
• Authors: Jian Jun Xi, Jun Zhao*, Zhi Gang Wang, Chun Ping Zhao, Mei Ping Xue
• Keywords: Copper, Electroplating, Morpholoy, Pulse, Thickness

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