Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers

Wen Lu; Jie Han; Jiang Bo Luo; Gui Fu Ding; Ran Chen

doi:10.4028/www.scientific.net/AMM.543-547.3914

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Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 543-547Fabrication of Redistribution Layer (RDL) Based on...

Fabrication of Redistribution Layer (RDL) Based on AlN/Sodium Silicate Composite for TSV Interposers

Abstract:

3D stacking technology with TSV interconnect is becoming a major trend of microsystem packaging. Redistribution layer (RDL) plays an important role in TSV packaging applications. Inorganic RDL based on AlN/sodium silicate composite through wet process has been put forward in this paper. After mixing AlN powder with sodium silicate uniformly and curing of the mixture, AlN/sodium silicate composite dielectric was formed. Finally a novel wet RDL process was developed for TSV interposer applications.

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Periodical:

Applied Mechanics and Materials (Volumes 543-547)

Pages:

3914-3917

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.543-547.3914

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Online since:

March 2014

Authors:

Wen Lu*, Jie Han, Jiang Bo Luo, Gui Fu Ding, Ran Chen

Keywords:

Composite Layer, Inorganic Dielectric, Redistribution Layer, Sodium Silicate

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