A Study on the Technical Method of Drilling Micro Holes on New CMC-SiC with Femtosecond Laser

Feng Wang; Jian Jun Luo; Ming Li; Yue Deng

doi:10.4028/www.scientific.net/AMM.543-547.3924

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Photoelectric Properties of Ultrathin BiOBr Nanosheets Synthesized by a PVP-Assisted Hydrothermal Method
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A Study on the Technical Method of Drilling Micro Holes on New CMC-SiC with Femtosecond Laser
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Application Research and Analysis of Bending Springback of Semi-Circular Arc Stamping Parts Based on DYNAFORM
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 543-547A Study on the Technical Method of Drilling Micro...

A Study on the Technical Method of Drilling Micro Holes on New CMC-SiC with Femtosecond Laser

Abstract:

To solve the difficulties of processing micro holes on the CMC-SiC, femtosecond laser was used as the drilling tool in this paper. And a new type of laser beam scanning module was studied. The study confirms the feasibility of finishing the processing of micro holes whose diameter is less than 2mm on the new CMC-SiC. And the preliminary optimization of processing parameters is completed. According to the experimental results, the important factors affecting the quality of the micro holes were analyzed, and the factors are the processing power and the scanning speed. The results also show that the femtosecond laser processing technology can solve the difficulties of drilling mirco holes on the new CMC-SiC in our countrys aerospace field.

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Periodical:

Applied Mechanics and Materials (Volumes 543-547)

Pages:

3924-3930

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.543-547.3924

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Online since:

March 2014

Authors:

Feng Wang*, Jian Jun Luo, Ming Li, Yue Deng

Keywords:

CMC-SiC, Femtosecond Laser, Laser Processing, Micro Holes, Taper

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* - Corresponding Author

References

[1] Chunhui Wang, Litong Zhang, Yongsheng Liu, Guanghua Cheng, Qing Zhang, Ke Hua: Applied Physics A Vol. 111(2013), p.1213.

Google Scholar

[2] Chunhui Wang, Litong Zhang, Yongsheng Liu, Qing Zhang, Ke Hua: Micromachining Feature of C/SiC Composites by Femtosecong Pluse Laser(CJJCC-10, China 2012).

Google Scholar

[3] D. Jorge, R. Luis: J. Mater. Process. Tech. 143–144, 342 (2003).

Google Scholar

[4] R. Naslain, Compos. Sci. Technol. 64, 155 (2004) CrossRef.

Google Scholar

[5] M. Rosso, J. Mater. Process. Technol. 175, 364 (2006) CrossRef.

Google Scholar

[6] L.T. Zhang, L.F. Cheng, Y.D. Xu, Aeronaut. Manuf. Technol. 1, 24 (2003).

Google Scholar

[7] LI Ming, CHENG Guang-hua, WANG Yi-shan, HE Jun-fang , CHEN Guo-fu, ZHAO Wei: ACTA PHOTONICA SINICA Vol. 38(2009), p.547(In Chinese).

Google Scholar

[8] Liu Qing, Cheng Guanghua, Wang Yishan, Zhao Wei, Chen Guofu: ACTA PHOTONICA SINICA Vol. 32(2003), p.276(In Chinese).

Google Scholar