Design Optimization of a Chip-Size Microchannel Heat Sink for High Power Devices

Jun Hong Zhao; Zhi Juan Wang; Gui Fu Ding; Gui Lian Wang; Yan Wang

doi:10.4028/www.scientific.net/AMM.543-547.596

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 543-547Design Optimization of a Chip-Size Microchannel...

Design Optimization of a Chip-Size Microchannel Heat Sink for High Power Devices

Abstract:

A novel design of flat chip-size microchannel heat sink for high power devices cooling is proposed and optimized. The inlet of cooling media is placed in the highest heat flux region, leading the coolest media into the region with the highest temperature directly, and as a result, the overall cooling efficiency is improved. Simultaneously, the collect channel is set and the inlet position is slightly off-center, which achieves a uniform temperature distribution. With the aid of a computational fluid dynamics (CFD) method, the temperature distribution of microchannel heat sink under steady-state conditions is examined and the microchannel distribution is optimized, forming an optimal design for the chip-size microchannel heat sink.

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Periodical:

Applied Mechanics and Materials (Volumes 543-547)

Pages:

596-599

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.543-547.596

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Online since:

March 2014

Authors:

Jun Hong Zhao*, Zhi Juan Wang, Gui Fu Ding, Gui Lian Wang, Yan Wang

Keywords:

CFD, Chip-Size, Inlet Position, Microchannel Distribution, Microchannel Heat Sink

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* - Corresponding Author

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