A Novel Method to Fabricate High Aspect Ratio Microcoils

Wen Jun Gu; Shi Sun; Xu Han Dai; Gui Fu Ding

doi:10.4028/www.scientific.net/AMM.543-547.600

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 543-547A Novel Method to Fabricate High Aspect Ratio...

A Novel Method to Fabricate High Aspect Ratio Microcoils

Abstract:

In this study, we developed a new method to fabricate microcoils with narrow and high aspect ratio coil lines using TSV and UV-LIGA technology in a SU-8 mold. The combination of SU-8 and TSV makes it possible to fabricate microstructures with high aspect ratio. TSV technology resolved the difficulties of electroplating with high aspect ratio. We designed and fabricated microcoils consisiting of coil lines with widths of 15μm and aspect ratio of 2.

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Periodical:

Applied Mechanics and Materials (Volumes 543-547)

Pages:

600-603

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.543-547.600

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Online since:

March 2014

Authors:

Wen Jun Gu*, Shi Sun, Xu Han Dai, Gui Fu Ding

Keywords:

Coil, MEMS, SU-8, TSV

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* - Corresponding Author

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