Tool Fault Analysis with Decision Tree Induction and Sequence Mining

Article Preview

Abstract:

Tool fault analysis is a common task for process engineers in modern industries to maintain high yields of the final products. Statistical process control is a monitoring method normally adopted by most engineers. Recently, there has been enormous awareness among industrial and manufacturing engineers that intelligent techniques from the data mining and machine learning fields can be applied to discover subtle patterns from the manufacturing process data. In this paper, we present the two data mining techniques, i.e. decision tree induction and sequence mining, to discover frequently occurred patterns of the low performance wafer lots in the semiconductor manufacturing industries. The comparative analysis results of both techniques are presented through experimentation over the standard data set for the purpose of re-experimentation.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

703-707

Citation:

Online since:

April 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] G. May and C. Spanos: Fundamentals of Semiconductor Manufacturing and Process Control (John Wiley & Sons, 2006).

Google Scholar

[2] S. Sarawagi, in: Advanced Methods for Knowledge Discovery from Complex Data, edited by S. Bandyopadhyay, U. Maulik, L.B. Holder, and D.J. Cook, Springer (2005), pp.153-187.

DOI: 10.1007/1-84628-284-5

Google Scholar

[3] A. Ison, W. Li and C. Spanos: Proceedings of IEEE International Symposium on Semiconductor Manufacturing, San Francisco (1997), B-49-B-52.

Google Scholar

[4] B. Goodlin, D. Boning, H. Sawin and B. Wise: Journal of the Electrochemical Society, 150, 12 (2003), G778-G784.

DOI: 10.1149/1.1623772

Google Scholar

[5] G. Spitzlsperger, C. Schmidt, G. Ernst, H. Strasser and M. Speil: IEEE Transactions on Semiconductor Manufacturing, 18, 4 (2005), pp.528-533.

DOI: 10.1109/tsm.2005.858495

Google Scholar

[6] Q. He and J. Wang: IEEE Transactions on Semiconductor Manufacturing, 20, 4 (2007), pp.345-354.

Google Scholar

[7] G. Verdier and A. Ferreira: IEEE Transactions on Semiconductor Manufacturing, 24, 1 (2011), pp.59-68.

Google Scholar

[8] E. Tafazzoli and M. Saif: Proceedings of American Control Conference, St. Louis (2009), pp.4329-3433.

Google Scholar

[9] Z. Ge and H. Song: IEEE Transactions on Semiconductor Manufacturing, 23, 1 (2010), pp.99-108.

Google Scholar

[10] M. McCann, Y. Li, L. Maguire and A. Johnston: Proceedings of JMLR Workshop, Canada (2008), pp.277-288.

Google Scholar

[11] L. Rokach, R. Romano and Q. Maimon: Journal of Intelligent manufacturing, 19 (2008), pp.313-325.

Google Scholar

[12] N. Ruschin-Rimini, O. Maimon and R. Romano: Journal of Intelligent manufacturing, 23 (2012), pp.481-495.

Google Scholar

[13] Advanced Analytics – Intel: SETFI: Manufacturing data: Semiconductor tool fault isolation. Causality Workbench Repository, http: /www. causality. inf. ethz. ch/ repository. php (2008).

Google Scholar

[14] A. Gabadinho, G. Ritschard, M. Studer and N. Muller: Mining Sequence Data in R with the TraMineR Package: A User's Guide. University of Geneva, Switzerland. (http: /mephisto. unige. ch/traminer/) (2011).

Google Scholar