Analysis of Interface Stress of Sn3.5Ag0.75Cu Solder under Temperature Cycle QFP Device

Abstract:

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Using elastoplastic finite element method study the interface stress distribution of Sn3.5Ag0.75Cu lead-free solder at different temperatures and different strain rate. Numerical analysis results show that: when strain-rate is identical, as the temperature rises, the interface stress increased rapidly of Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites, from 11 °C when 2.6MPa rose to 90 °C in 49.7MPa, so the temperature is very large have effects of the interface stress of the lead-free solder and the substrate binding sites; when the temperature is constant, as the strain rate increases, Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites of the interface stress showed a slight increase, from 0.005% / S when the 49.47MPa rose to 0.005% / S when the 50.08MPa, so strain rate on lead-free solder and the substrate binding sites of the interface stress effect is very small, indicating Sn3 .5Ag0.75Cu lead-free solder has strong rate-independent nature.

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Periodical:

Edited by:

Qi Luo

Pages:

1468-1472

DOI:

10.4028/www.scientific.net/AMM.55-57.1468

Citation:

Z. Li et al., "Analysis of Interface Stress of Sn3.5Ag0.75Cu Solder under Temperature Cycle QFP Device", Applied Mechanics and Materials, Vols. 55-57, pp. 1468-1472, 2011

Online since:

May 2011

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Price:

$35.00

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