The Behavior and Effect of Nano-Copper on the Interface in the Process of Sintering Fe-Base Powder Metallurgy Parts
The tested samples by adding 1.0% nano-copper powder and Fe-base powder mixed with globe grind violently are sintered at 600, 650, 700, 750, 800, 850°C, and keeping temperature 30 minutes and 1, 2, 3, 4 hours at 600°C. The nano-copper morphology changes of impacting fracture surface are observed by scan electrical microscopy (SEM). The results showed that the nano-copper particles occur adsorption rapidly, diffusion and dissolution at Fe-base powder particle interface with increasing sintering temperature at the same keeping temperature times and extending keeping temperature times at the same sintering temperature. The nano-copper particles grow up by reunite and existing unconventional growimg up critical temperature Tc. The nano-copper particles dissolve at the nano-Fe powder surface at the lower sintering temperature, and decreasing the sintering temperature to 920°C.
X. Y. Zhang "The Behavior and Effect of Nano-Copper on the Interface in the Process of Sintering Fe-Base Powder Metallurgy Parts", Applied Mechanics and Materials, Vols. 55-57, pp. 1613-1618, 2011