The Behavior and Effect of Nano-Copper on the Interface in the Process of Sintering Fe-Base Powder Metallurgy Parts

Xiao Yu Zhang

doi:10.4028/www.scientific.net/AMM.55-57.1613

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 55-57The Behavior and Effect of Nano-Copper on the...

The Behavior and Effect of Nano-Copper on the Interface in the Process of Sintering Fe-Base Powder Metallurgy Parts

Abstract:

The tested samples by adding 1.0% nano-copper powder and Fe-base powder mixed with globe grind violently are sintered at 600, 650, 700, 750, 800, 850°C, and keeping temperature 30 minutes and 1, 2, 3, 4 hours at 600°C. The nano-copper morphology changes of impacting fracture surface are observed by scan electrical microscopy (SEM). The results showed that the nano-copper particles occur adsorption rapidly, diffusion and dissolution at Fe-base powder particle interface with increasing sintering temperature at the same keeping temperature times and extending keeping temperature times at the same sintering temperature. The nano-copper particles grow up by reunite and existing unconventional growimg up critical temperature Tc. The nano-copper particles dissolve at the nano-Fe powder surface at the lower sintering temperature, and decreasing the sintering temperature to 920°C.

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Periodical:

Applied Mechanics and Materials (Volumes 55-57)

Pages:

1613-1618

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.55-57.1613

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Online since:

May 2011

Authors:

Xiao Yu Zhang

Keywords:

Diffusion, Fe-Based Powder, Fracture Surface, Nano-Copper, Sintering

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