Electrochemical Investigation Cu Corrosion Behaviour of Electronic Circuit Board in Base Electrolyte

Zhi Hua Tao; Bin Leng; Chong Wang; Ding Jun Xiao; Ze Tan; Wei He

doi:10.4028/www.scientific.net/AMM.556-562.141

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 556-562Electrochemical Investigation Cu Corrosion...

Electrochemical Investigation Cu Corrosion Behaviour of Electronic Circuit Board in Base Electrolyte

Abstract:

The eleetronic material, or even the whole equipments may be destroyed by very slight corrosion, so it is important to study the corrosion mechanism and corrosion protections. The Cyproconazole as a Cu corrosion inhibitor for Electronic Circuit Board in the base electrolyte (containing 70 ppm chloride ions, 0.54 mol/L H₂SO₄ and 0.8 mol/L CuSO₄ ) was investigated using polarization curves and AC impedance. The results showed that the inhibition performance of the Cyproconazole depended on the concentration of the inhibitor and the highest inhibition efficiency of the Cyproconazole reached 99.9% at 1×10^-3 mol/L in the base electrolyte. The results obtained from EIS measurements are in good agreement with that obtained from potentiodynamic polarization. Potentiodynamic polarization studies clearly revealed that Cyproconazole adsorption acted essentially as the mixed-type inhibitor.

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Periodical:

Applied Mechanics and Materials (Volumes 556-562)

Pages:

141-144

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.556-562.141

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Online since:

May 2014

Authors:

Zhi Hua Tao*, Bin Leng, Chong Wang, Ding Jun Xiao, Ze Tan, Wei He

Keywords:

EIS, Electrolyte, Electronic Circuit Board, Inhibition Efficiency

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* - Corresponding Author

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