Preparation and Characterization of Moisture-Cure Polyurethane for Bonding Wood

Jing Du; Meng Meng Zhou; Ling Ling Ma; Fei Cao; Ji Jun Xiao

doi:10.4028/www.scientific.net/AMM.563.102

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 563Preparation and Characterization of Moisture-Cure...

Preparation and Characterization of Moisture-Cure Polyurethane for Bonding Wood

Abstract:

Abstract. In this work, one-component moisture-cure polyurethane was synthesized, which is mainly used as adhesives for bonding wood. The properties of the polyurethane were characterized by Fourier Transform Infrared Spectroscopy(FTIR), thermal gravimetric analysis(TGA), dynamic mechanical thermal analysis(DMA) and electronic universal testing machine. The results indicate that the shear strength and tensile strength increase with increasing of NCO/OH ratio in 2 to 4, however, when the ratio more than 4, it will be decreased gradually. The TGA and DMA results show that the polyurethane film has relatively high thermal stability with a weight loss of 5% at 298 °C and the glass transition temperature is 97.52 °C.

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Periodical:

Applied Mechanics and Materials (Volume 563)

Pages:

102-106

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.563.102

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Online since:

May 2014

Authors:

Jing Du, Meng Meng Zhou, Ling Ling Ma, Fei Cao, Ji Jun Xiao*

Keywords:

Moisture-Cure, One-Component, Polyurethane, Wood

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