Fault Analysis of Smart Meter Based on Metering Chip Failure Analysis

Xue Yang; Peng He Zhang; Sheng Chen; Chun Yu Li; Ya Tao Wang; Hao Qi Li

doi:10.4028/www.scientific.net/AMM.568-570.437

Paper Titles

Development of Portable Electronic Nose for VOC Detection
p.420

Performance Test and Simulation on Broadband PAA Transducer for Pipeline Detection
p.424

Study on the Method of Establishing Standardized Testing System in Marine Sounding Sonar
p.428

Study on the Motor Vibration Based on LabVIEW and FFT
p.433

Fault Analysis of Smart Meter Based on Metering Chip Failure Analysis
p.437

An IP Based Audio Test Network for Tunnel Application
p.441

Analysis and Application on Performance Testing System for Magnetic Latching Relay Used in Smart Meter
p.448

Based on Adaptive Notch Filter Design of Underwater Acoustic Transponder for Seismic Exploration in Shallow Sea
p.452

Design of Fault Diagnosis Vehicle Terminal Based on ARM11
p.457

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 568-570Fault Analysis of Smart Meter Based on Metering...

Fault Analysis of Smart Meter Based on Metering Chip Failure Analysis

Abstract:

Based on the metering principles of smart meter, this paper designed a sub-module function testing system which can analysis the function of smart meter. According to the principle of the bathtub curve, based on the sub-module function test prototype , we accelerated thermal stress test for the metering chip. By comparing the sampling channel data before and after the test, this paper proposed the metering chip failure analysis methods and processes, to find the cause of the failure, and thus form a “smart meter-metering chip-smart meter” failure analysis flow which can using for the smart meter.

You might also be interested in these eBooks

Measurement Technology and its Application III

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 568-570)

Pages:

437-440

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.568-570.437

Citation:

Cite this paper

Online since:

June 2014

Authors:

Xue Yang, Peng He Zhang, Sheng Chen, Chun Yu Li, Ya Tao Wang, Hao Qi Li

Keywords:

Failure Analysis, Metering Chip, Smart Meter

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Li Yongjun, Xu Xiaorong, Jin Yongqiang, Wang Hailong, Chen Lijia. System of High-precision Multi-function Time Calibrator Based on XCS10[J]. Journal of Zhengzhou University: ENG SCI, 2012, 33(1), 113-116.

Google Scholar

[2] Ken Gilleo. Overview of New Packages, Materials and Processes[R]. 2001 International Symposium on Advanced Packaging Materials.

Google Scholar

[3] Frank A. Lindberg. High Density Microelectronic Packaging with Thick Film Hermetic Packages[J]. IEEE, 2002, 12(3): 96-102.

DOI: 10.1109/ectc.1991.163860

Google Scholar

[4] Zhu Xiaolong, Zhu Yongxin. Validation analysis of abnormal display on graphic chip[J]. Electronic test, 2011, 10: 13-18.

Google Scholar

[5] Charles W.C. Lin, Sam C.L. Chiang, T.K. 3D Stackable Packages With Bumpless Intercoonnect Technology[R]. 2003 Electronic Packaging Technology Conference.

DOI: 10.1109/eptc.2003.1271481

Google Scholar