Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices

Abstract:

Focused ion beam (FIB) system is a powerful microfabrication tool which uses electronic lenses to focus the ion beam even up to nanometer level. The FIB technology has become one of the most necessary failure analysis and failure mechanism study tools for microelectronic device in the past several years. Bonding failure is one of the most common failure mechanisms for microelectronic devices. But because of the invisibility of the bonding interface, it is difficult to analyze this kind of failure. The paper introduced the basic principles of FIB technology. And two cases for microelectronic devices bonding failure were analyzed successfully by FIB technology in this paper.

• Periodical: Applied Mechanics and Materials (Volumes 58-60)
• Pages: 2171-2176
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.58-60.2171
• Online since: June 2011
• Authors: Yuan Chen, Xiao Wen Zhang
• Keywords: Bonding Failure, Failure Analysis, Focused Ion Beam (FIB), Microelectronic Device

References

[1] J. Orloff, M. Utlaut and L. Swanson: High Resolution Focused Ion Beams: FIB and Its Applications (Kluwer Academic Publishers, New York 2003).

DOI: 10.1063/1.1650073

[2] R. Boylan, M. Ward and D. Tuggle: Proceedings of the 15th International Symposium for Testing and Failure Analysis, Nov. 1989, pp.249-255.

[3] A.A. Tseng: J. Micromechanics and Microengineering Vol. 14 (2004), pp.15-34.

[4] J.M. Soden and R.E. Anderson: Microelectron Reliab, Vol. 35 (1995), pp.429-453.

[5] Y. Chen and X.W. Zhang: Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging, Aug. 2010, pp.957-960.

[6] C.M. Tan, E. Er, Y. Hua and V. Chai: IEEE Transactions on Components, Packaging, Manufacturing and Technology, Part A, Vol. 21 (1998), pp.585-591.