Comparision of Thermal Analysis in Mobile Phone Using Ansys

B. Jayachandraiah

doi:10.4028/www.scientific.net/AMM.592-594.1875

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 592-594Comparision of Thermal Analysis in Mobile Phone...

Comparision of Thermal Analysis in Mobile Phone Using Ansys

Abstract:

“Necessity is the Mother of Invention”- one of the most Important and Interesting Man Made Inventions is Mobile Phone. there is a Rapid Increase in the Number of Users of Mobile Phone in the Last Decade. Today, it's Hard to Find a Cell Phone that Doesn't Offer some Sort of "smart" Technology because it's in such a High Demand. the Use of Mobile Phone has Become an Integral Part of Human Lives. in this Paper, an Attempt is Made to Study the Optimization of 3-Dimensional Heat Transfer Phenomena in Mobile Phone Using ANSYS for Three Different Models and Different Companies such as HTC Desire C, Nokia Lumia 900 and Sony Xperia Tipo. the Actual Dimensions and Materials are Chosen for above Models. the Three Models are Modelled in Pro/E, then Meshed by 3D-10 Nodded Tetrahedral Thermal Solid Elements (SOLID87) and Analysed in ANSYS Software, by Applying Boundary Conditions. the Analysis is Carried-out to Find the Nodal Temperatures, Directional Thermal Fluxes. it is Found that the Optimum Heat Transfer Occurs at HTC Desire C and Validated with the References.

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Periodical:

Applied Mechanics and Materials (Volumes 592-594)

Pages:

1875-1880

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.592-594.1875

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Online since:

July 2014

Authors:

B. Jayachandraiah*

Keywords:

ANSYS, Comparision of Thermal Fluxes, HTC Desire C, Nokia Lumia 900, Sony Xperia Tipo

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