Status and Prospect of Disassembly Process of Electronic Components on Waste PCBs

Pei Lun Li; Yi Feng Shi; Dian Wen Liu

doi:10.4028/www.scientific.net/AMM.599-601.1989

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Status and Prospect of Disassembly Process of Electronic Components on Waste PCBs
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 599-601Status and Prospect of Disassembly Process of...

Status and Prospect of Disassembly Process of Electronic Components on Waste PCBs

Abstract:

With the development and exhaustion of resources, the reclamation of secondary resources, especially urban mine, must be on the agenda. The major part of urban mine is waste printed circuit board (WPCB), and the effective processing of WPCB is depend on the disassembly. This article analyze the form of fastening, the method of fusion welding ,the recovery of welding and the disassembly of electronic component in process of disassembly, and point out the direction and tendency of development.