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Microstructure Analysis of Ti-Al Intermetallic Compound Aluminized Layer Generated in Low Temperature
Abstract:
By using mechanical energy aided aluminizing process, an aluminized layer of 20~180μm was obtained on titanium plate at a low temperature of 650~700°C for 3 hours. The aluminized layer consists of an outer layer of single-phase aluminium, an inner layer of (Al,Si)3Ti intermetallic compound and aluminium bipolar layer, the silicon element is riched in the Al3Ti intermetallic compound.
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1508-1511
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September 2014
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© 2014 Trans Tech Publications Ltd. All Rights Reserved
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