Microstructure Analysis of Ti-Al Intermetallic Compound Aluminized Layer Generated in Low Temperature

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Abstract:

By using mechanical energy aided aluminizing process, an aluminized layer of 20~180μm was obtained on titanium plate at a low temperature of 650~700°C for 3 hours. The aluminized layer consists of an outer layer of single-phase aluminium, an inner layer of (Al,Si)3Ti intermetallic compound and aluminium bipolar layer, the silicon element is riched in the Al3Ti intermetallic compound.

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1508-1511

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September 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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