Flow Boiling Enhancement by the Surface Quenched in Nanofluid

Wen Bin Cui; Zhi Quan Zhang; Chang Jian Song; Feng Min Su; Hong Bin Ma

doi:10.4028/www.scientific.net/AMM.672-674.1449

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 672-674Flow Boiling Enhancement by the Surface Quenched...

Flow Boiling Enhancement by the Surface Quenched in Nanofluid

Abstract:

A quenched surface was applied in flow boiling, which is fabricated by quenching a piece of copper in carbon nanotube (CNT) fluid.Its performance was compared with bare copper, and the results showed that the quenched surface can enhance the heat flux by 15–20%. Quenched surface was less effective in enhancing heat flux as the flow rate and liquid subcooling was increased.

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Periodical:

Applied Mechanics and Materials (Volumes 672-674)

Pages:

1449-1453

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.672-674.1449

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Online since:

October 2014

Authors:

Wen Bin Cui*, Zhi Quan Zhang, Chang Jian Song, Feng Min Su, Hong Bin Ma

Keywords:

Flow Boiling, Heat Flux Enhancement, Nanofulid, Quenched Surface

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* - Corresponding Author

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