New Plasma Surface Processing Technology and its Application

Abstract:

Plasma surface processing technology can improve the mechanical properties, the corrosion resistance and chemical properties of the parts; therefore it has been widely used in industrial field. Advanced plasma surface processing technology is also constantly innovation, high power pulsed magnetron sputtering technique has been studied and explored by many scholars in recent years, and also gradually began to be used in the industry . This paper mainly introduces the study of HiPIMS dynamic and application over the past ten years. The HiPIMS discharge mechanism research method and theory is summarized .And the influence of the preparation process parameters about voltage, pressure, pulse width and frequency to compound film performance is systematically described, a detection method for thin film by HiPIMS is also introduced. These will provide guidance for the preparation of reactive HiPIMS.

• Periodical: Applied Mechanics and Materials (Volume 697)
• Pages: 21-26
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.697.21
• Online since: November 2014
• Authors: Tian Dong Cao*, Chang Zi Chen
• Keywords: HiPIMS, Magnetron Sputtering, Plasma Surface Processing, Reactive Film

References

[1] N. Huang, P. Yang, Y.X. Leng, et al, Hemocompatibility of titanium oxide films, Biomaterials. 24(2003)2177-2187.

DOI: 10.1016/s0142-9612(03)00046-2

[2] Leng Y.X., Chen J.Y., Yang P. et al, The microstructure and mechanical properties of TiN and TiO2/TiN duplex films synthesized by plasma immersion ion implantation and deposition on artificial heart valve, Surface and Coatings Technology. 201(2006).

DOI: 10.1016/j.surfcoat.2006.01.024

[3] B. Goranchev, V. Orlinov, and V. Popova. cathode sputtering: influence of the oxygen content in the gas flow on the discharge current, Thin Solid Films. 33(1976)173-183.

DOI: 10.1016/0040-6090(76)90078-x

[4] H. Savaloni, A. Taherizadeh, A. Zendehnam. Residual Stress in Cu Sputtered Films on Glass Substrates at Different Substrate Temperatures Journal of Sciences, Islamic Republic of Iran 15(3) (2004) 277-282.

DOI: 10.1016/j.physb.2004.01.158

[5] A. Rojo, J. Solı´s, J. Oseguera et al. Tribological Properties of CrN/AlN Films Produced by Reactive Magnetron Sputtering, Journal of Materials Engineering and Performance. 19(3) (2010) 421.

DOI: 10.1007/s11665-009-9508-5

[6] Jens Emmerlich, Stanislav Mra´ z, Rony Snyders. The physical reason for the apparently low deposition rate during high-power pulsed magnetron sputtering, Vacuum 82 (2008) 867-870.

DOI: 10.1016/j.vacuum.2007.10.011

[7] Helmersson U, Lattemann M, Bohlmark J. Review ionized physical vapor deposition (IPVD): A review of technology and applications, Thin Solid Film. 513 (1-2) (2006)1-24.

DOI: 10.1016/j.tsf.2006.03.033

[8] Reinhard C, Ehiasarian A P, Hovsepian P E. CrN/NbN superlattice structured coatings with enhanced corrosion resistance achieved by high power impulse magnetron sputtering interface pretreatment, Thin Solid Films. 515(7-8) (2007)3685-3692.

DOI: 10.1016/j.tsf.2006.11.014

[9] Alami J, Eklund P, Emmerlich J, High-power impulse magnetron sputtering of Ti-Si-C thin films from a Ti3SiC2 compound target, Thin Solid Films. 515(4) (2006)1731-1736.

DOI: 10.1016/j.tsf.2006.06.015

[10] In J H, Seo S H, Chang H Y, A novel pulsing method for the enhancement of the deposition rate in high power pulsed magnetron sputtering Surface and Coatings Technology., 202(22-23) (2008) 5298-5301.

DOI: 10.1016/j.surfcoat.2008.06.141

[11] Ehiasarian A P, Wen J G, Petrov J, Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion, Journal of Applied Physics. 101(5) (2007) 054301.

DOI: 10.1063/1.2697052

[12] Dirk Ochs, HIPIMS Power for Improved Thin Film Coatings, Vakuum in Forschung und Praxis. 20 Nr. 4 (2008) 34-38.

DOI: 10.1002/vipr.200800362

[13] Information on http: /www. hauzer. cn.

[14] Kouznetsov V, Maca K, Schneider J M, A novel pulsed magnetron sputter technique utilizing very high target power densities, Surface and CoatingsTechnology. 122(2-3) (1999) 290-293.

DOI: 10.1016/s0257-8972(99)00292-3

[15] Sarakinos K, Alami J, Konstantinidis S, High power pulsed magnetron sputtering: a review on scientific and engineering state of the art, Surface and Coatings Technology. 204(2010) 1661–1684.

DOI: 10.1016/j.surfcoat.2009.11.013

[16] J. Alami, P. Eklund, J.M. Andersson, et al, Phase tailoring of Ta thin films by highly ionized pulsed magnetron sputtering, Thin Solid Films. 515 (2007) 3434-3438.

DOI: 10.1016/j.tsf.2006.10.013

[17] Arutiun P. Ehiasarian, High-power impulse magnetron sputtering and its applications, Pure Appl. Chem. 82(2010)1247-1258.

DOI: 10.1351/pac-con-09-10-43

[18] W. -D. Münz, HIPIMS: The New PVD Technology, WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ( 2008 ) 27-32.

[19] André Anders, Discharge physics of high power impulse magnetron sputtering Surface & Coatings Technology. 205 (2011) S1-S9.

DOI: 10.1016/j.surfcoat.2011.03.081

[20] André Anders, Joakim Andersson, Arutiun Ehiasarian, High power impulse magnetron sputtering: Current-voltage-time characteristics indicate the onset of sustained self-sputtering, JOURNAL OF APPLIED PHYSICS. 102(2007)113-303.

DOI: 10.1063/1.2817812

[21] Ken Yukimura , Ryosuke Mieda , Kingo Azuma et al. Voltage–current characteristics of a high-power pulsed sputtering (HPPS)glow discharge and plasma density estimation, Nuclear Instruments and Methods in Physics Research B. 267 (2009)1692–1695.

DOI: 10.1016/j.nimb.2009.01.106

[22] Satoshi Watanabe, Takeshi Tanaka, Toshinori Takagi et al, Estimation of plasma density in after-glow region of RF burst plasma based on voltage–current characteristics, Surface & Coatings Technology. 186 (2004)53-56.

DOI: 10.1016/j.surfcoat.2004.04.009

[23] K. Yukimura, R. Mieda , H. Tamagaki et al, Electrical characteristics of arc-free high-power pulsed sputtering glow plasma, Surface & Coatings Technology. 202 (2008)5246-5250.

DOI: 10.1016/j.surfcoat.2008.06.021

[24] Scott Kirkpatrick, Anomalous Current and Voltage Fluctuations in high Power Impulse Magnetron Sputtering, UMI Microform 3365710(2009). 1-280.

[25] TIAN Xiu-bo, WU Zhong-zhen, SHI Jing-wei, et al, Development and discharge behavior of high power density pulse magnetron sputtering system, VACUUM. 47 (2010) 44-47.

[26] MU Zongxin, WANG Chun, JIA Li, et al, Study of discharge properties and parameters of high power pulsed unbalanced magnetron sputtering, Nuclear Fusion and Plasma Physics. 30(2010) 365-368.

[27] MichaelA. Lieberman, Allan J. Lichtenberg, Principles of Plasma Discharges and Material Processing, second ed., wiley, Berkeley, (1994).

[28] H. Klostermann , F. Fietzke, R. Labitzke, et al, Zr–Nb–N hard coatings deposited by high power pulsed sputtering using different pulse modes, Surface & Coatings Technology. 204 (2009) 1076–1080.

DOI: 10.1016/j.surfcoat.2009.09.012

[29] A. P. Ehiasarian, J. G. Wen ,I. Petrov, Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion, JOURNAL OF APPLIED PHYSICS. 101(2007) 054301.

DOI: 10.1063/1.2697052

[30] F.J. Jing, T.L. Yin, K. Yukimura et al, Titanium film deposition by high-power impulse magnetron sputtering: Influence of pulse duration , Vacuum. 86 (2012)2114-2119.

DOI: 10.1016/j.vacuum.2012.06.003

[31] Tai-Lei Yin, Feng-Juan Jing, Hong Sun et al, Microstructure and Platelet Adhesion Behavior of Titanium Oxide Films Synthesized by Reactive High-Power Pulse Magnetron Sputtering, IEEE TRANSACTIONS ON PLASMA SCIENCE. 41( 2013) 1837-1842.

DOI: 10.1109/tps.2013.2250528

[32] M. Audronis, V. Bellido-Gonzalez, Hysteresis behaviour of reactive high power impulse magnetron sputtering, Thin Solid Films. 518 (2010) 1962–(1965).

DOI: 10.1016/j.tsf.2009.12.011

[33] F. Horstmann, V. Sittinger, B. Szyszka, Heat treatable indium tin oxide films deposited with high power pulse magnetron sputtering, Thin Solid Films. 517 (2009) 3178-3182.

DOI: 10.1016/j.tsf.2008.11.092

[34] A.P. Ehiasarian, W. -D. Munz, L. Hultman, et al, High power pulsed magnetron sputtered CrNx films, Surface and Coatings Technology. 163-164 (2003) 267-272.

DOI: 10.1016/s0257-8972(02)00479-6

[35] M. Fenker , H. Kappl, K. Petrikowski, et al, Pulsed power magnetron sputtering of a niobium target in reactive oxygen and/or nitrogen atmosphere, Surface & Coatings Technology. 200 (2005) 1356-1360.

DOI: 10.1016/j.surfcoat.2005.08.074

[36] K. Bobzin , N. Bagcivan , P. Immich et al, Mechanical properties and oxidation behaviour of (Al, Cr)N and (Al, Cr, Si)N coatings for cutting tools deposited by HPPMS, Thin Solid Films. 517 (2008) 1251-1256.

DOI: 10.1016/j.tsf.2008.06.050

[37] A. Guillaumot, F. Lapostolle, C. Dublanche-Tixier, et al, Reactive deposition of AleN coatings in Ar/N2 atmospheres using pulsed-DC or high power impulse magnetron sputtering discharges Vacuum. (2010)1-6.

DOI: 10.1016/j.vacuum.2010.04.012

[38] J. Paulitsch , M. Schenkel , Th. Zufras , et al, Structure and properties of high power impulse magnetron sputtering and DC magnetron sputtering CrN and TiN films deposited in an industrial scale unit, Thin Solid Films. 518 (2010)5558-5564.

DOI: 10.1016/j.tsf.2010.05.062

[39] Jin-Hyo Boo, UHeon Kyu Park, Kyung Hoon Nam, et al, High rate deposition of poly-Si thin films at low temperature using a new designed magnetron sputtering source, Surface and Coatings Technology. 131 (2000) 211-215.

DOI: 10.1016/s0257-8972(00)00827-6