Thermal Analysis on the Crack of External Thermal Insulation System of XPS Board

Abstract:

• Periodical: Applied Mechanics and Materials (Volumes 71-78)
• Pages: 2010-2016
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.71-78.2010
• Online since: July 2011
• Authors: Xin Hu, Cheng Wen Yan
• Keywords: Crack, Durability, External Insulation of Exterior Wall, Heat Transfer, Temperature Stress

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