Thermal Analysis on the Crack of External Thermal Insulation System of XPS Board

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Edited by:

Dongye Sun, Wen-Pei Sung and Ran Chen

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2010-2016

DOI:

10.4028/www.scientific.net/AMM.71-78.2010

Citation:

X. Hu and C. W. Yan, "Thermal Analysis on the Crack of External Thermal Insulation System of XPS Board", Applied Mechanics and Materials, Vols. 71-78, pp. 2010-2016, 2011

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July 2011

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