The Anti-Vibration Design of the Ball Grid Array Solder Joint

Fan You; Yong Guang Huang; Ben Li

doi:10.4028/www.scientific.net/AMM.713-715.103

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 713-715The Anti-Vibration Design of the Ball Grid Array...

The Anti-Vibration Design of the Ball Grid Array Solder Joint

Abstract:

In order to improve the anti-vibration performance of the Ball Grid Array solder joints, its solid model is established in ANSYS. Analyzing the stress response under the shock and vibration environment by using the finite element method. Then discussing the stress response of solder joints with different diameters and different heights in the same shock and vibration environment of each location for providing the basis for anti-vibration design. The results show that the longer diameter and lower height solder joint is more favorable to improve its anti-vibration performance.

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Periodical:

Applied Mechanics and Materials (Volumes 713-715)

Pages:

103-106

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.713-715.103

Citation:

Cite this paper

Online since:

January 2015

Authors:

Fan You*, Yong Guang Huang, Ben Li

Keywords:

Anti-Vibration, Finite Element, Solder Joints, Stress

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* - Corresponding Author

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