Characteristic Study on Parylene-C Film for Thermal Isolation on Chip

Abstract:

This paper deposited parylene-C films as thermal isolation filling material on the micro-trenches. The stress characteristic and the conformal coating characteristic of the parylene-C films were analyzed. The small stress and the good conformal coating are helpful for film material to decrease their influences on the mechanical and electric performances of the devices. The thermal isolation performance experiment was performed. The results showed that the temperature in the inside part of the testing device with a heating resistance is obviously higher than that in the outside part, separated by the thermal isolation structures coating with parylene films.

• Periodical: Applied Mechanics and Materials (Volumes 713-715)
• Pages: 2610-2613
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.713-715.2610
• Online since: January 2015
• Authors: Xu Ji*, Wei Wang, Xiang Bo Song, Hai Li Li, Xi Luo
• Keywords: On Chip, Parylene-C, Stress, Thermal Isolation

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