Effects of Soldering Temperature on IMCs Formation between Sn-0.7Cu Solder and Cu Substrate

Abstract:

The interfacial reaction and growth of intermetallic compounds (IMCs) between the eutectic Sn-0.7 wt.% Cu solder and Cu substrate during soldering process were investigated experimentally. The Sn-0.7Cu/Cu couples were fabricated with soldering temperature varied at four levels of 300, 340 and 360°C. Microstructural analysis is conducted to analyze the IMCs thickness and morphology using scanning electron microscope. Two intermetallic phases were observed during soldering at the interface: η-phase (Cu₆Sn₅) and ε-phase (Cu₃Sn) IMC layers, except for the solder joints which were fabricated at low temperature. The thickness of the η and ε IMC phases increase with increasing the soldering temperature. It’s found that the increase in total IMC layer thickness obeys a linear relationship with soldering temperature. And the relationship between X and T was given as X = 0.0866×T – 22.5 by means of linear fitting method.

• Periodical: Applied Mechanics and Materials (Volumes 713-715)
• Pages: 2685-2688
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.713-715.2685
• Online since: January 2015
• Authors: Zhi Xian Min*, Xiao Wu Hu, Ying Xia Qiu
• Keywords: Intermetallic Compounds, Solder Joint, Soldering Temperature

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