Preparation and Curing Behavior of Silicone-Modified Phenolic Resin

Abstract:

Silicone-modified phenolic resin was prepared by synthesizing phenol, formaldehyde and phenyltrimethoxysilane, which were supported by Fourier Transform Infrared Spectoscopy (FT-IR). The carbon residual rate of Silicone-modified phenolic resin increased steeply when the silicone modifier was added increasing from 5% to 15%(on resin base) which was tested in an air atmosphere,from room temperature to 800 °C by Thermogravimetric Analysis (TG) ,modified resin of 15% silicone modifier had the highest carbon residue rate. Curing process of silicone-modified phenolic resin determined by Differential Scanning Calorimetry (DSC) was: 80°C/4h+100°C/2h+120°C/2h+160°C/3h+180°C/2h. Curing Kinetic Study on silicone-modified phenolic resin was made to understand the curing process better.

• Periodical: Applied Mechanics and Materials (Volumes 713-715)
• Pages: 2798-2803
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.713-715.2798
• Online since: January 2015
• Authors: Yi Xin Qi*, Yan Qin, Min Xian Shi, Yun Xia Li
• Keywords: Curing Behavior, Phenolic Resin, Silicone-Modification

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