Critical Soldering Interconnect Technology in SMT

Xiao Ming Hu

doi:10.4028/www.scientific.net/AMM.713-715.3001

Paper Titles

The Study of Electronic Density of States and Optical Properties of ZnO Nanotube by First-Principles
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A Study on the Carbon Emissions Calculation Model of Iron and Steel Products Based on EIO-LCA
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Research on the W/O Emulsion Stability Influenced by the Content of Salt and Surfactants
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Analysis of Optimization about the Wall Temperature of the Biomass Fuel Hot Stove
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Study on the Relationship between Meteorological Conditions and Brine Evaporation Rate
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Modelling the Natural Evaporation of the Concentrated Seawater after Desalinized
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Pyrolysis Characteristics and Kinetics of Walnut Shell
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Ultrasonic Assisted Extraction Process Optimization of Malabar Spinach Seed Oil and GC-MS Analysis
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Critical Soldering Interconnect Technology in SMT
p.3001

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 713-715Critical Soldering Interconnect Technology in SMT

Critical Soldering Interconnect Technology in SMT

Abstract:

this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must place components in through-hole ways , then we use wave soldering. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. As technology changing very soon, the through-hole components have been largely replaced by surface mount components, this time ,Reflow soldering is the most common method of attaching surface mount components to a circuit board,but not wave soldering also reflowing, we must focus on wetting , It quantifies the wettability of a solid surface by a liquid .wetting angle is a the important quantity (also called contact angle).it can judge the quality of solder joints.