Performance Simulation of the SCTP under the Multi Path Environment

Ya Qin Fan; Shu Ting Liu; Chi Li

doi:10.4028/www.scientific.net/AMM.738-739.1174

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 738-739Performance Simulation of the SCTP under the Multi...

Performance Simulation of the SCTP under the Multi Path Environment

Abstract:

This paper studies the basic features and functions of STCP. The traditional TCP protocol and the basic standard SCTP protocols are simulated respectively. We analysis that when the host has multiple network addresses and there are multiple paths between ends, how do the STCP protocol and TCP protocol perform. For practical implementation, using CWND size parameters show performance of multi path transmission in practice, and compare with the ideal case. The results of the simulation and analysis of multi path transmission under the SCTP agreement have practical significance in the future network with multi path transmission.

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Periodical:

Applied Mechanics and Materials (Volumes 738-739)

Pages:

1174-1177

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.738-739.1174

Citation:

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Online since:

March 2015

Authors:

Ya Qin Fan*, Shu Ting Liu, Chi Li

Keywords:

Fulid Bandwidth, Multi Path, STCP

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* - Corresponding Author

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