Sensors, Measurement, Intelligent Materials and Technologies III

Sensors, Measurement, Intelligent Materials and Technologies III

Description:

Collection of selected, peer reviewed papers from the 2014 3rd International Conference on Sensors, Measurement and Intelligent Materials (ICSMIM 2014), November 25-26, 2014, Zhuhai, China.
The 269 papers are grouped as follows:
Chapter 1: Sensors and Materials for Sensors, their Applications;
Chapter 2: Smart and Functional Materials and Technologies, Analysis, Design, Processing;
Chapter 3: Remote Sensing and Telemetry Technology;
Chapter 4: Intelligent Information and Expert Systems, Applications for Management and Product Design;
Chapter 5: Algorithms, Computation Methods and their Applications;
Chapter 6: Mathematical Methods and Modelling, Information Technologies in Industrial Engineering;
Chapter 7: Data, Text, Sound, Image, Signal and Video Processing and Technologies, Data Acquistion, their Applications;
Chapter 8: Testing, Detection, Measurement, Monitoring Technologies and Instruments;
Chapter 9: Mechatronics, Industrial Robotics, Automation and Control Technology;
Chapter 10: Computer Networks, Communication Technology and E-Commerce;
Chapter 11: Modern Electronic, Circuit Technology, Electrical and Power Engineering;
Chapter 12: Software Applications and Development.

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Info:

Editors:
Yun-Hae Kim and Prasad Yarlagadda
THEMA:
TBC, TGB, TGM
BISAC:
TEC000000
Details:
Selected, peer reviewed papers from the 2014 3rd International Conference on Sensors, Measurement and Intelligent Materials (ICSMIM 2014), November 25-26, 2014, Zhuhai, China
Pages:
1400
Book Set:
2 Books set
Year:
2015
ISBN-13 (softcover):
9783038354055
ISBN-13 (CD):
9783038591085
ISBN-13 (eBook):
9783038267911
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView: Editors Kim and Yarlagadda present students, academics, researchers, and professionals working in a variety of contexts with a two-volume collection of peer-reviewd academic essays and scholarly articles selected from research presented at the third International Conference on Sensors, Measurement, and Intelligent Materials held in November of 2014 in Zhuhai, China. The editors have organized the main body of the text in twelve chapters split between the two volumes. Subjects covered include sensors and materials for sensors and their applications, smart and functional materials and technologies, analysis, design, processing, and a wide variety of other related subjects.

Ringgold Subjects:

— Artificial Intelligence
— Materials Science
— Sensors