Design and Simulation of Thermopile Sensor Technology Based on Porous Silicon

Yan Wei Dou; Cheng Jun Qiu; Bo Zang; Jing Xuan Wang; Xiao Dong Zhang

doi:10.4028/www.scientific.net/AMM.741.289

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 741Design and Simulation of Thermopile Sensor...

Design and Simulation of Thermopile Sensor Technology Based on Porous Silicon

Abstract:

Thermopile sensor using porous silicon (PS) as thermal isolation layer was designed. Thermal stability and mechanical property of sensor were simulated by IntelliSuite CAD software. Analysis results showed stress and temperature distribution of PS layer. Ansys simulation indicated that thermocouple’s thermoelectromotive force was decided by its material composition. If thermocouple was composed of polycrystalline silicon/aluminum, its thermoelectromotive force would reach 256.8 μV/K.

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Periodical:

Applied Mechanics and Materials (Volume 741)

Pages:

289-293

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.741.289

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Online since:

March 2015

Authors:

Yan Wei Dou*, Cheng Jun Qiu, Bo Zang, Jing Xuan Wang, Xiao Dong Zhang

Keywords:

ANSYS, IntelliSuite CAD, Porous Silicon

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* - Corresponding Author

References

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