Development of Epoxy/BN Composites with High Thermal Conductivity for Metal-Core Printed Circuit Board (MCPCB)

Abstract:

The epoxy composites with high thermal conductivity for metal-core printed circuit board (MCPCB) can be prepared by varnish coating and a hot press method. Alumina filler of plate-like shape was used as primary micro-filler, while plate-like alumina filler, h-BN, a-BN and s-BN filler were used for blending into the plate-like alumina filler as the secondary filler. Results showed that the secondary fillers a-BN and s-BN loaded epoxy composites have higher thermal conductivity than alumina filler single-loaded composites. Also, BN filler has high thermal conductivity, but h-BN filled epoxy composite has lower thermal conductivity than alumina filled epoxy composite. The decrease of voids in epoxy composite are very important, and the filler shape and surface modification is also necessary to achieve high thermal conductivity in epoxy composite for MCPCB

• Periodical: Applied Mechanics and Materials (Volume 749)
• Pages: 290-294
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.749.290
• Online since: April 2015
• Authors: Jae Hyun Choi, Bong Goo Choi, Min A. Lee, Jae Sik Na*
• Keywords: Boron Nitride, Epoxy Composite, MCPCB, Thermal Conductivity, Thermal Diffusivity

References

[1] G.W. Lee, M. Park, J. Kim, J.I. Lee, H.G. Yoon, Enhanced thermal conductivity of polymer composites filled with hybrid filler, Compos Part A 37 (2006) 727-734.

DOI: 10.1016/j.compositesa.2005.07.006

[2] K.H. Kim, J.H. Kim, Fabrication of thermally conductive composite with surface modified boron nitride by epoxy wetting method, Ceram. Int. 40 (2014) 5181-5189.

DOI: 10.1016/j.ceramint.2013.10.076

[3] Z. Wang, T. Lizuka, M. Kozako, Y. Ohki, T. Tanaka, Development of Epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength Part I-Sample preparations and thermal conductivity, IEEE Trans. Dielectr. Electr. Insul. 17 (2010).

DOI: 10.1109/tdei.2011.6118634

[4] M. Kozako, Y. Okazaki, M. Hikita and T. Tanaka, Preparation and evaluation of epoxy composite insulating materials toward high thermal conductivity, IEEE Int'l. Conf. Solid Dielectr. (2010) 1-4.

DOI: 10.1109/icsd.2010.5568250

[5] Y. Miyazaki, T. Nishiyama, H. Takahashi, J.I. Katagiti, Y. Takezawa, Development of highly thermalconductive epoxy composites, IEEE CEIDP 2009 annual report, 638-641.

[6] K.H. Kim, M.J. Kim, Y.S. Hwang, J.H. Kim, Chemically modified boron nitride-epoxyterminated dimethylsiloxane composite for improving the thermal conductivity, Ceram. Int. 40 (2014) 2047-(2056).

DOI: 10.1016/j.ceramint.2013.07.117

[7] T. Imai, F. Sawa, T. Ozaki, T. Shimizu, Shin-Ichi Kuge, M. Kozako and T. Tanaka, Effects of Epoxy/Filler Interface on Properties of Nano- or Micro- composites", IEEJ Trans. Fundamentals and Materials, 126 (2006) 84-91.

DOI: 10.1541/ieejfms.126.84

[8] K. Wattanakul, H. Manuspiya, N. Yanumet, Effective surfacetreatments for enhancing the thermal conductivity of BN-filled epoxycomposite, J. Appl. Polym. Sci. 119 (2011) 3234–3242.

DOI: 10.1002/app.32889