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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 752-753Femtosecond Ti:Sa Laser Processing of Silica

Femtosecond Ti:Sa Laser Processing of Silica

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Abstract:

The result of direct ablation of silicon by an 800 nm Ti:Sa femtosecond laser pulses are presented. Obtained slice of silicon with submicron roughness with tilt focused femtosecond laser pulses. Yaw cut more due to mechanical vibrations of the entire installation on a pneumatic table, but not the physics of the ongoing process. During processing, possibly thinning the silicon sample from the opposite edge (sharpening) to submicron values (tens of nanometers).

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Periodical:

Applied Mechanics and Materials (Volumes 752-753)

Pages:

452-457

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.752-753.452

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Online since:

April 2015

Authors:

Michael Babiy*, Yuliya Biryukova, Sergey Golik, Vladimir Lisitsa

Keywords:

Ablation, Femtosecond Laser, Femtosecond Machining, Laser Micromachining, Nanoposition, Silicon

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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