Finite Element Analysis of Stress and Strain Distribution in Gold Thin Film Deposited on Polycarbonate Substrate Subjected to Tension and Cooling

Naoya Tada; Ya Fei Hu

doi:10.4028/www.scientific.net/AMM.752-753.55

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 752-753Finite Element Analysis of Stress and Strain...

Finite Element Analysis of Stress and Strain Distribution in Gold Thin Film Deposited on Polycarbonate Substrate Subjected to Tension and Cooling

Abstract:

Thin metal films on polymeric materials have been widely used in electronic devices. Their total mechanical performance is determined by the mechanical property of each material, the thickness and size of film and substrate, their interface properties in addition to the temperature change during production and use. In this paper, stress and strain distribution of gold thin film on polycarbonate substrate subjected to tension and cooling was analyzed using the finite element method. The effect of cracking in thin film on the stress and strain distribution was also discussed.

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Periodical:

Applied Mechanics and Materials (Volumes 752-753)

Pages:

55-61

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.752-753.55

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Online since:

April 2015

Authors:

Naoya Tada*, Ya Fei Hu

Keywords:

Bending, Cooling, Cracking, Curvature, Gold Thin Film, Polycarbonate, Strain, Stress, Tension

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