Research on Seebeck Coefficient of Thin-Film Thermocouple on Temperature-Testing Cutter

Abstract:

Performance of current temperature sensor is not satisfactory on monitoring transient temperature of cutting edge. A temperature-testing cutter is presented in this paper and analysis of Seebeck coefficient on thin film thermocouple is proposed with experiments. Thin film thermocouple is embedded into the cutting edge using magnetron sputtering technology. According to the fact that electrical conductivity can be replaced by the multiplication of electron mean free path λ and effective Fermi surface area A, a universal formula of thermoelectric power is given based on the diffuse thermoelectric power equation put forward by Mott and Jones. Using the expression of electron mean free path in gas model λ, the relationship of thermoelectric power between thin film and bulk material can be deduced. Result shows that the main influential factor of Seebeck coefficient is film thermal junction thickness. In addition, the Seebeck coefficient of different junction size and film thickness were tested by LabVIEW automatic calibration system. The experimental data indicates that Seebeck coefficient is determined by thermal junction thickness, and the sensor is found to be linear from room temperature up to 600°C while the Seebeck coefficient of thin film thermocouple becomes closer to standard thermocouple as the film thickness increments. However, junction size does not have a major influence on the Seebeck coefficient which is agreed by both theoretical analysis and test.

• Periodical: Applied Mechanics and Materials (Volume 757)
• Pages: 139-146
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.757.139
• Online since: April 2015
• Authors: Yun Xian Cui*, Yang An, Jia Hui Zhao, Xiao Xing Sheng
• Keywords: Seebeck Coefficient, Static Characteristic, Temperature-Testing Cutter, Thin Film Thermocouple

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