Numerical Study of Mold Filling during Encapsulation Process

Abstract:

3-D packaging is a technology that offers high density packaging and high performance. It enables chips to be stack in a single package and widely adopted in multi-media products. Thermosetting material is used for their encapsulation, is flowed through their thin space and wide filling area during package encapsulation process has become vital concern i.e. void formation. In this paper, such issue has been numerical studied due to the effect of transfer speed of the plunger head during encapsulation process. There are five transfer speeds of 1.6, 2.0, 3.4, 6.8, 9.04 mm/s have been chosen in order to investigate the quality of air entrapped (hereafter namely as void), where it degraded the package’s reliability. It is found that the longest transfer speed delivered to the best encapsulation process, which had lowest volume of air trap or void formation in the package.Keywords: Encapsulation, Transfer speed, Vent arrangement, Void Formation

• Periodical: Applied Mechanics and Materials (Volume 786)
• Pages: 318-322
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.786.318
• Online since: August 2015
• Authors: M.F. Hamid, Muhammad Khalil Abdullah*, H. Yusoff, Sheikh Mohd Firdaus, Mohd Zulkifly Abdullah, Zulkifli Mohamad Ariff, M.A. Azmi
• Keywords: Encapsulation, Transfer Speed, Vent Arrangement, Void Formation

References

[1] M.K. Abdullah, S. Kamarudin, Z.M. Ariff, P. Hussirf, JJ Antony, H. Haroon, M. R Saad, M. Manikam, Three-Dimensional mold flow in Stacked-Chip Scale Packages (S-CSP), Proceedings of 31st IEEE International Conference on Electronics Manufacturing and Technology, 2007, Kuala Lumpur, Malaysia, pp.135-142.

DOI: 10.1109/iemt.2006.4456445

[2] M.F.M.A. Majid, C. Y Khor, M.K. Abdullah, M.Z. Abdullah, W.Y. Rahiman, A. Jappar, M.S. Aris, Three Dimensional Numerical Prediction of Epoxy Flow During the Underfill Process in Flip Chip Packaging, Proceedings of 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2012, Ipoh, Malaysia, pp.1-6.

DOI: 10.1109/iemt.2012.6521810

[3] H. Wang, H. Zhou, Y. Zhang, D. Li, Stabilized filling Simulation of Microchip Encapsulation Process, Microelectronic Engineering. 87 (2010) 2602–2609.

DOI: 10.1016/j.mee.2010.07.026

[4] D. Ramdan, M.Z. Abdullah, N.M. Yusop, Effect of Outlet Vent Arrangement on Air Traps in Stacked Chip Scale Package Encapsulation, International Communication in Heat and Mass Transfer. 39: 3 (2012) 405-413.

DOI: 10.1016/j.icheatmasstransfer.2011.12.011

[5] C.Y. Khor, M.Z. Abdullah, H.J. Tony Tan, W.C. Leong, D. Ramdan, Investigation of the Fluid/Structure Interaction Phenomenon in IC Packaging, Microelectronic Engineering. 52: 1 (2012) 241-252.

DOI: 10.1016/j.microrel.2011.09.013

[6] S.Y. Teng, S.J. Hwang, Simulations and Experiments of Three-Dimensional Paddle Shift for IC Packaging, Microelectronic Engineering. 85 (2008) 115-125.

DOI: 10.1016/j.mee.2007.04.148

[7] R.Y. Chang, W.H. Yang, E. Chen, C. Lin, C. H. Hsu, On the Dynamics of Air-Trap in the Encapsulation Process of Microelectronic Package, Proceedings of Annual Technical Conference, 26-30 April 1998, Atlanta (GA), USA, pp.1178-1180.

[8] Z.M. Ariff, T.H. Khang, Evaluation of Cadmould Software to Simulate the Filling Phase of a Natural Rubber Compound in Injection Moulding Process, Advanced Materials Research. 747 (2013) 571-574.

DOI: 10.4028/www.scientific.net/amr.747.571

[9] M.K. Abdullah, M.Z. Abdullah, M.A. Mujeebu, Horizon Gitano, Z.M. Ariff, R Razali, K.A. Ahmad, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process with a Matrix-Array Arrangement, Journal of Electronic Packaging. 132: 1 (2010).

DOI: 10.1115/1.4000719