Effects of Adhesive Bond on Active Repair of Aluminium Plate Using Piezoelectric Patch

Abstract:

Research activities on active repairs and stress control of structures using piezoelectric actuators and adhesive bond have received much attention in recent years. The function of the adhesive bond on active repair is to transmit the induced stresses by the piezoelectric actuator to the host structure in order to reduce the stress intensity on the crack front. Assessment of repair performance of adhesive bonds is done based on the transfer of the shear and peel stress concentration in the adhesive layer. In the present work, three dimensional finite element analyses have been carried to understand the effects of adhesive properties on active repair performance of a cracked aluminium plate under mode I. Adhesive efficiency is evaluated by the stress intensity factor (SIF) as a fracture criterion. The results show that SIF varies inversely with the adhesive layer’s shear modulus.

• Periodical: Applied Mechanics and Materials (Volumes 799-800)
• Pages: 788-793
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.799-800.788
• Online since: October 2015
• Authors: Ahmed Abuzaid*, Mohamed Shaik Dawood, Meftah Hrairi
• Keywords: Active Repair, Adhesive Bond, Piezoelectric Actuator, Stress Intensity Factor

References

[1] H. Hosseini-Toudeshky, B. Mohammadi, G. Sadeghi, and H. R. Daghyani, Compos. Part A Appl. Sci. Manuf., vol. 38, no. 4, p.1141–1148, Apr. (2007).

[2] D. J. Campilho RDSG, de Moura MFSF, Ramantani DA, Morais JJL, Adhes Adhes, vol. 29: 678–86, (2009).

[3] W. G. Liu X, Compos Struct, vol. 81: 331–4, (2007).

[4] B. B. Bouiadjra, D. Ouinas, B. Serier, and N. Benderdouche, Comput. Mater. Sci., vol. 42, no. 2, p.220–227, Apr. (2008).

[5] R. C. Alderliesten, Int. J. Fatigue, vol. 31, no. 6, p.1024–1030, Jun. (2009).

[6] T. J. C. Liu, Theor. Appl. Fract. Mech., vol. 47, no. 2, p.120–132, Apr. (2007).

[7] Q. Wang, G. Y. Zhou, and S. T. Quek, Adv. Struct. Eng., vol. 8, no. 4, p.411–426, Aug. (2005).

[8] Q. Wang, W. H. Duan, and S. T. Quek, Int. J. Mech. Sci., (2004).

[9] S. Choi and Y. Han, Piezoelectric actuators: control applications of smart materials, CRC Press. (2010).

[10] A. American and N. Standard, An American National Standard IEEE Standard on Piezoelectricity, (1988).

[11] ANSYS 2013 Ansys help Version 14. 5 ANSYS.

[12] H. Tada, P. C. Paris, and G. R. Irwin, The Stress Analysis of Cracks Handbook, Third Edition. Three Park Avenue New York, NY 10016-5990: ASME, (2000).