Experimental Investigation of Heat Transfer in Coated Microchannels for MEMS Applications

Article Preview

Abstract:

The microchannel cooling technique appears to be a viable solution to high heat rejection requirements of today’s high-power electronic devices. The thermal design of the small electronics cooling devices is a key issue that needs to be optimized in order to keep the system temperatures at certain levels. Thus the need of microchannel became vital. This present work investigates the experimental work conducted in a coated rectangular microchannel heat sink of hydraulic diameter of 0.763 mm for a heat input of 250 to 1020 Watt with water to study the heat transfer characteristics with two types of header arrangement such as rectangular header and trapezoidal header. The header plays a significant role in distributing the water in to the channels. The uniform distribution of water leads to uniform heat transfer in microchannels. From the experimental results carried with two types of header arrangements, it was found that coated rectangular microchannel with trapezoidal header gives better heat transfer characteristics for the range of heat inputs.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

782-786

Citation:

Online since:

November 2015

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2015 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] D.B. Tuckerman and R.F.W. Pease, High performance heat sinking for VLSI, IEEE Electron Device Letter EDL-2 (1981) 126-129.

DOI: 10.1109/edl.1981.25367

Google Scholar

[2] Sathish G. Kandlikar, History, Advances, and challenges in liquid flow and Flow Boiling Heat transfer in Microchannels: A critical review, Journal of Heat transfer Vol. 134 (2012) 1-14.

DOI: 10.1115/1.4005126

Google Scholar

[3] Weilin Qu, Issam Mudawar, Experimental and numerical study of pressure drop and heat transfer in a single phase microchannel heat sink, Int. Journal of heat and mass transfer (2002) 2549-2565.

DOI: 10.1016/s0017-9310(01)00337-4

Google Scholar

[4] A. A. Alfaryjat, H. A. Mohammed. Nor Mariah Adam, M.K.A. Ariffin, M.I. Najafabadi, Influence of geometrical parameters of hexagonal, circular, and rhombus microchannel heat sinks on the thermohydraulic characteristics, Int. communications in Heat and Mass transfer 52 (2014).

DOI: 10.1016/j.icheatmasstransfer.2014.01.015

Google Scholar

[5] Vikash Khanikar, Issam Mudawar, Timothy Fisher, Effects of carbon nanotube coating on flow boiling in a mico-channel, International Journal of Heat and Mass Transfer 52 (2009) 3805 – 3817.

DOI: 10.1016/j.ijheatmasstransfer.2009.02.007

Google Scholar

[6] M. Yakut Ali, Fanghao Yang, Ruixian fang, Chen Li, and Jamil Khan, Thermohydraulic characteristics of a Single-Phase Microchannel heat sink coated with copper nanowires , Frontiers in Heat and Mass Transfer 2 (2011) 1-11.

DOI: 10.5098/hmt.v2.3.3003

Google Scholar

[7] G. Rosengarten , J. Cooper – White, G. Metcalfe, Experimental and analytical study of the effect of contact angle on liquid convective heat transfer inmicrochannels, Int. Journal of Heat and mass Transfer 49 (2006) 4161-4170.

DOI: 10.1016/j.ijheatmasstransfer.2006.02.057

Google Scholar

[8] A.K.M.M. Morshed, Fanghao Yang, M. Yakut Ali, Jamil A. Khan, Chen Li, Enhanced flow boiling in a microchannel with integration of nanowires, Applied thermal Engineering (2011) 1-8.

DOI: 10.1016/j.applthermaleng.2011.08.031

Google Scholar

[9] C. Anbumeenakshi, T.R. Vijaybabu, M.R. Thansekhar, Experimental Investigation Of Flow Maldistribution In Microchannels, Int. Journal of Innovative Research in Science, Engineering and Technology Volume 3 Special Issue 3 (2014) 1410-1413.

Google Scholar