Transient Analysis of Microchannel Heat Sink during Single Phase and Flow Boiling Conditions

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In the present work, an experimental investigation has been made to analyze the performance of microchannel heat sink under transient operating conditions. The transient analysis has been made by estimating the response time for different input heat flux and coolant mass flow rate. Analysis has been made for rectangular cross-section microchannels fabricated on a copper block of size 25.7 × 12 × 10 mm3. Twelve (12) numbers of microchannels are fabricated in the copper block. The width and depth of individual channels are 400 μm and 750 μm respectively. Performance analysis has been made for both single phase and flow boiling conditions of the coolant flow using deionized water as coolant. Experiments have been performed for coolant mass flux (G) range of 90 - 250 kg/m2s and input heat flux (q) range of 20 - 300 kW/m2 respectively. It has been observed that at constant input heat flux, response time decreases with the increase in coolant mass flux during single phase cooling. However this trend is not strongly followed during the two-phase or flow boiling cooling condition.

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101-106

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January 2016

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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[1] S. G. Kandlikar, Fundamental issues related to flow boiling in minichannel and microchannels, Experimental Thermal and Fluid Science, 26 (2002) 389–407.

DOI: 10.1016/s0894-1777(02)00150-4

Google Scholar

[2] T. Harirchian, S. V. Garimella, Effects of channel dimension, heat flux, and mass flux on flow boiling regimes in microchannels, International Journal of Multiphase Flow, 35 (2009) 349–362.

DOI: 10.1016/j.ijmultiphaseflow.2009.01.003

Google Scholar

[3] J. Lee, I. Mudawar, Fluid flow and heat transfer characteristics of low temperature two-phase micro-channel heat sinks – Part 1: Experimental methods and flow visualization results, International Journal of Heat and Mass Transfer, 51 (2008).

DOI: 10.1016/j.ijheatmasstransfer.2008.02.012

Google Scholar

[4] J.R. Thome, V. Dupont, A.M. Jacobi, Heat transfer model for evaporation in Microchannels, International Journal of Heat and Mass Transfer, 47 (2004) 3375–3385.

DOI: 10.1016/j.ijheatmasstransfer.2004.01.006

Google Scholar

[5] Y. K. Prajapati, M. Pathak, Mohd. Kaleem Khan, Experimental and numerical analysis of microchannel heat sink, Proceedings of International mechanical engineering congress, NIT Tiruchirappalli, India, June 12-15 (2014) 133-136.

Google Scholar

[6] S. R. Rao, F. Houshmand, Y. Peles, Transient flow boiling heat-transfer measurements in microdomains, International Journal of Heat and Mass Transfer, 76 (2014) 317–329.

DOI: 10.1016/j.ijheatmasstransfer.2014.03.029

Google Scholar

[7] W. Zhu, Y. Deng, Y. Wang, A. Wang, Finite element analysis of miniature thermoelectric coolers with high cooling performance and short response time, Microelectronics Journal, 44(2013) 860–868.

DOI: 10.1016/j.mejo.2013.06.013

Google Scholar

[8] A. Conti, G. Lorenzini, Y. Jaluria, Transient conjugate heat transfer in straight microchannels, International Journal of Heat and Mass Transfer, 55 (2012) 7532–7543.

DOI: 10.1016/j.ijheatmasstransfer.2012.07.046

Google Scholar

[9] J.R. Rujano, M.M. Rahman, Transient Response of Microchannel Heat sinks in a Silicon wafer, Journal of Electronic Packaging, 119 (1997) 239-246.

DOI: 10.1115/1.2792243

Google Scholar

[10] J. Zhang, T. Zhang, S. Prakash and Y. Jaluria, Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks, Numerical Heat Transfer, Part A, 65 (2014) 627–643.

DOI: 10.1080/10407782.2013.846594

Google Scholar