Modeling of Cut Depth and Surface Analyses of Silicon Wafer in Laser Micromachining Process

Seksit Mekloy; Viboon Saetang; Chaiya Dumkum

doi:10.4028/www.scientific.net/AMM.835.242

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 835Modeling of Cut Depth and Surface Analyses of...

Modeling of Cut Depth and Surface Analyses of Silicon Wafer in Laser Micromachining Process

Abstract:

Silicon has widely been used as a substrate material in various microfabrication processes. Cut depth and surface morphology of silicon obtained from laser ablation process have to be well controlled to achieve the required features of micro-components being made. Though laser power has been known as a major factor affecting these responses, the detailed investigations of this factor on cut geometries and surface quality have still been deficiency. In this research, the cut geometries and surface characteristics of silicon induced by a pulse laser were experimentally investigated. The increase in laser power not only increased the cut dimensions, but also increased the debris deposition on and inside the cut channel. Furthermore, an analytical model was developed in this study to predict the cut depth of silicon in pulsed laser ablation, and an agreement between the prediction and experiment was also demonstrated.

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Periodical:

Applied Mechanics and Materials (Volume 835)

Pages:

242-247

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.835.242

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Online since:

May 2016

Authors:

Seksit Mekloy, Viboon Saetang*, Chaiya Dumkum

Keywords:

Laser, Machining, Modeling, Silicon, Surface

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* - Corresponding Author

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