Parametric Analysis of Floor Cooling

Lucie Horká; Jan Weyr

doi:10.4028/www.scientific.net/AMM.861.401

Paper Titles

Evaluation of Indoor Climate in Small University Lecture Hall
p.369

Recommendations for Automatic Opening Vents (AOV) in an Office Building in Terms of Thermal Instability in Relation to Natural Ventilation and Cooling
p.376

Impact of Inlet Boundary Conditions on the Fluid Distribution of Supply Duct
p.384

Monitoring of a Prototypical Free-Running Building: A Case Study in a Hot-and-Humid Climate
p.392

Parametric Analysis of Floor Cooling
p.401

Effect of Ventilation in Protected Escape Ways upon the Thermal Properties of these Spaces
p.409

Energy Saving Potential of Personalized Ventilation Applied in an Open Space Office under Winter Conditions
p.417

The Importance of Cooperation between Heating and Ventilation in the Industry Buildings
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CFD Model of Thermal Plume Occuring above Hot Surface of Kitchen Appliance
p.433

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 861Parametric Analysis of Floor Cooling

Parametric Analysis of Floor Cooling

Abstract:

This study is aimed at parametric analysis of floor cooling. Impact of several design parameters such as air temperature, temperature of cooling water, distance of cooling pipes, thickness and thermal conductivity of top layer on total heat transfer of cooling floor is studied. The issue is solved by steady-state 2D numerical simulation of heat transfer to the floor construction. These parametric simulations are performed in software CalA. Impact of variable input parameters on total heat transfer is observed. Results of parametric analysis are displayed in a nomogram. This nomogram is useful for faster designing of floor cooling.

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Periodical:

Applied Mechanics and Materials (Volume 861)

Pages:

401-408

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.861.401

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Online since:

December 2016

Authors:

Lucie Horká*, Jan Weyr

Keywords:

Floor Cooling, Nomogram, Numerical Simulation, Parametrical Analysis, Software CalA

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* - Corresponding Author

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