Synchronous Measurement of Three-Dimensional Deformations Using Tri-Channel Spatial-Carrier Digital Speckle Pattern Interferometry

Abstract:

Spatial-carrier digital speckle pattern interferometry (SC-DSPI) has proven to be a competitive tool for full-field deformation measurement. Comparing with traditional phase-shifting digital speckle pattern interferometry, SC-DSPI has the advantage of rapid measurement which guarantees that dynamic deformations can be precisely measured. In this article, a tri-channel SC-DSPI that measures three-dimensional deformations synchronously is introduced. Measuring algorithm as well as optical arrangement is described in detail. Experiments are carried out to verify the validity and evaluate the performance of the proposed technique.

• Periodical: Applied Mechanics and Materials (Volume 868)
• Pages: 316-322
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.868.316
• Online since: July 2017
• Authors: Yao Fang, Si Jin Wu*, Lian Xiang Yang
• Keywords: Digital Holographic Interferometry, Digital Speckle Pattern Interferometry, Fourier Transform, Spatial Carrier, Three-Dimensional Deformation Measurement

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