Bi-Layered Model of Interfacial Thermal Stresses with the Effect of Different Temperatures in the Layers

Abstract:

An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.

• Periodical: Applied Mechanics and Materials (Volume 87)
• Pages: 63-70
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.87.63
• Online since: August 2011
• Authors: Sujan Debnath, Muhammad Ekhlasur Rahman, Woldemichael Dereje Engida, M. V. V. Murthy, K.N. Seetharamu
• Keywords: Different Uniform Temperature Model, Linear Temperature Gradient Model, Peel Stress, Shearing Stress

References

[1] Tsai M. Y., Hsu C. H., and Han C. N. (2004) A note on Suhir's Solution of Thermal Stresses for a Die-Substrate Assembly: Journal of Electronic Packaging., (2004), Vol. 126, pp.115-119.

DOI: 10.1115/1.1648056

[2] Timoshenko. S. (1925). Analysis of Bi-Metal Thermo-stats., J. Opt. Soc. Am. 11, p.233.

[3] Suhir E. (1986). Stresses in Bimetal Thermostats, Journal of Applied Mechanics, Vol. 53, p.657.

[4] Suhir E. (1989). Interfacial Stresses in Bimetal Thermostats, ASME J. Appl. Mech. Vol. 56, p.595.

DOI: 10.1115/1.3176133

[5] Sujan D., Seetharamu K. N., Hassan A. Y., and Murthy M. V. V. (2004). Engineering Model for Interfacial stresses of a heated bimaterial Structure Used in Electronic Packaging, 6th EMAP, Penang, Malaysia, pp.181-187.

DOI: 10.4071/1551-4897-2.2.132

[6] Sujan D., Murthy M. V. V., Seetharamu K. N., and Hassan A. Y. (2005).

[7] Matthys L. and Mey G. D. (1996)., An analysis of an Engineering model for the Thermal Mismatch Stresses at the Interface of a Uniformly Heated Two Layer Structure, The International Journal of Electronic Packaging., Vol. 19, No. 3, p.323.

[8] Mirman I. B. (1991). Effects of Peeling Stresses in Bimaterial Assembly, ASME Journal of Electronic Packaging 1, p.431.

DOI: 10.1115/1.2905433

[9] Moore. T. D. and Jarvis. J. L. (2003). A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures., Microelectron Reliab. 43, p.487.

DOI: 10.1016/s0026-2714(02)00317-7

[10] Moore. T. D. and Jarvis. J. L. (2004). The Peeling Moment A Key Rule for Delamination Resistance in I.C. Assemblies, Vol. 126, p.106.

DOI: 10.1115/1.1649240

[11] Ru. C.Q. (2002). Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited., ASME Journal of Electronic Pacaging., 124(3), p.141.

DOI: 10.1115/1.1481037

[12] Brown W. D. (1999). Advanced Electronic Packaging. IEEE Press, p.241.