Dicing Characterization on Optical Silicon Wafer Waveguide

J.B. Saedon; Siti Musalmah Md Ibrahim; Amir Radzi Abd Ghani; Muhammad Hafizi Bin Abd Razak

doi:10.4028/www.scientific.net/AMM.899.163

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 899Dicing Characterization on Optical Silicon Wafer...

Dicing Characterization on Optical Silicon Wafer Waveguide

Abstract:

Silicon wafers are a key component in integrated circuits which comprised of various electronic components that are arranged to perform a specific function. Wafer dicing is a mechanical process of removing material from a wafer by synthetic diamonds as abrasive particles. Chipping along the cut line crucial to the wafer dicing operation has been identified by semiconductor manufacturers as a relevant area for improvement. The purposed of this study is to characterize the effect of dicing operation on the optical silicon wafer coating material. The effect of the blade wear and silicon wafer kerf width will be analyzed in this work

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Periodical:

Applied Mechanics and Materials (Volume 899)

Pages:

163-168

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.899.163

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Online since:

June 2020

Authors:

J.B. Saedon*, Siti Musalmah Md Ibrahim, Amir Radzi Abd Ghani, Muhammad Hafizi Bin Abd Razak

Keywords:

Dicing, Optical Dicing Machine, Photonic Waveguide, Waveguide Cutting

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References

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