Numerical Study on Bending Behavior of Copper Alloy Thin Plate by Single Pulse Laser

Su Qin Jiang; Ai Hui Liu; Xue Ting Wang; Jian Hua Wu; Bo Kui Li

doi:10.4028/www.scientific.net/AMR.1003.113

Paper Titles

Study on the Properties of Multi-Extruded Recycled PE and PP
p.96

Research on Carbon Materials with Synthesis and Characterization of Graphene-Based
p.100

Influence of Original Surface Roughness on Ultrasonic Deep Rolling Effects
p.105

The Application of Tissue Engineering and Biological Materials on Exercise-Induced Meniscus Injury
p.109

Numerical Study on Bending Behavior of Copper Alloy Thin Plate by Single Pulse Laser
p.113

Research on Electrical Engineering with a Multi Energy-Type Coordinated Micro-Grid Day-Ahead Scheduling Strategy Based on IPSO Algorithm
p.119

Research on Electrical Engineering with a New Fault Location Method of Double Terminal Based on HHT
p.124

Design and Implementation of Frequency Measuring Circuit Based on Countdown Counter
p.130

Condition Assessment for Power Transformer Based on Improved Evidence Combination Rule
p.135

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1003Numerical Study on Bending Behavior of Copper...

Numerical Study on Bending Behavior of Copper Alloy Thin Plate by Single Pulse Laser

Abstract:

To study the bending characteristics of copper alloy thin plate by single pulse laser, the thermal mechanical coupling model of pulsed laser forming (PLF) was established; the dynamic change and steady distribution for the fields of temperature, stress& strain and displacement were analyzed. The results show n that during the pulse laser heating stage, the temperature gradient along the thickness direction is far less than that of the heat affected zone; due to the constraints of materials around the heating field, the compressive stress and negative strain are appeared, the cantilever end of sample produces warping deformations; in the cooling stage, the temperature of top and bottom surface material drops rapidly, the sample is with a negative bending and reduced deformation. This is related to the transferring of the stress change and the recovery of part of the elastic deformation in heating area.

You might also be interested in these eBooks

Advanced Research on Material Engineering, Electrical Engineering and Applied Technology II

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 1003)

Pages:

113-116

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1003.113

Citation:

Cite this paper

Online since:

July 2014

Authors:

Su Qin Jiang*, Ai Hui Liu, Xue Ting Wang, Jian Hua Wu, Bo Kui Li

Keywords:

Bending Forming, Copper Alloy, Numerical Simulation, Single Pulse Laser

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Yu Kuigang, Jing Sun, Lai Xinmin. Journal of Shanghai Jiaotong University, Vol. 43 (12) (2009), p. (1941).

Google Scholar

[2] F Vollertsen, Z Hu, H Schulze Niehoff, et al. Journal of Materials Processing Technology, 151 (2004), p.70.

Google Scholar

[3] Jeong H, Hata S. Journal of Microelectromechanical Systems, 12 (2003), p.42.

Google Scholar

[4] Marya M, Edwards GR. Journal of materials processing technology, 108 (2001) , p.376.

Google Scholar

[5] N. B. Dahotre, S. P. Harimkar. Laser fabrication and machining of materials, Chapter 8: Laser forming( 2008), p.291.

Google Scholar

[6] J. P. Wulfsberg, M. Terzi. Investigation of laser heating in microforming applying sapphire tool[J]. Annals of the CIRP，56(1) (2007), p.321.

DOI: 10.1016/j.cirp.2007.05.074

Google Scholar

[7] B. Y. Huang, C. G. Li. China Materials Engineering Canon (4), Non-Ferrous Materials Engineering (on), Chemical Industry Press, Bei Jin (2005).

Google Scholar