Effect of Process Parameters on Warpage of Printer Board with Metal-Insert

Cheng Juan Liu; Xian Kun Huang; Qiu Ping Wu; Hai Qin He; Yan Ping Li

doi:10.4028/www.scientific.net/AMR.1004-1005.1141

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1004-1005Effect of Process Parameters on Warpage of Printer...

Effect of Process Parameters on Warpage of Printer Board with Metal-Insert

Abstract:

In order to study the influence of process parameters on forming quality of printer board with metal-insert,shorten the development cycle,reduce the enterprise cost,the warp trend and reasons of injection process parameters,including packing time,hold pressure,mold temperature,melt temperature,on the warpage of the part were analyzed by means of software moldflow. The results show that warpage amounts decreases with packing time and hold pressure increasing,larger packing time and longer hold pressure is advantageous to the injection parts molding;And warpage amounts increases with mold temperature and melt temperature increasing,the lower mold temperature and melt temperature is advantageous to the injection parts molding;Among the four parameters,the melt temperature had the greatest influence,followed by the mold temperature and the hold pressure,packing time had the minimal influence on the warpage.

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Periodical:

Advanced Materials Research (Volumes 1004-1005)

Pages:

1141-1146

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1004-1005.1141

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Online since:

August 2014

Authors:

Cheng Juan Liu, Xian Kun Huang, Qiu Ping Wu, Hai Qin He, Yan Ping Li*

Keywords:

Injection Process, Metal-Insert, Moldflow, Process Parameter, Warpage

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* - Corresponding Author

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